Semiconductor chip having a crack stop structure
US-12406940-B2 · Sep 2, 2025 · US
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Goroll Michael patents
Goroll Michael is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Goroll Michael |
| Total patents | 7 |
| First publication | Jan 15, 2015 |
| Latest publication | Sep 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip with crack guiding structure combined with crack stop structure
US-2024145408-A1 · May 2, 2024 · US
Semiconductor chip having a crack stop structure
US-2022270985-A1 · Aug 25, 2022 · US
Semiconductor package with interlocked connection
US-10090216-B2 · Oct 2, 2018 · US
Semiconductor Package With Interlocked Connection
US-2017170082-A1 · Jun 15, 2017 · US
Semiconductor module with interlocked connection
US-9627305-B2 · Apr 18, 2017 · US
Semiconductor module with interlocked connection
US-2015014845-A1 · Jan 15, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 5 |
| H10W90/736 | 4 |
| H10W90/734 | 4 |
| H10W74/00 | 4 |
| H10W72/952 | 4 |