Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US-12564012-B2 · Feb 24, 2026 · US
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Goradia Prerna patents
Goradia Prerna is listed as an inventor on 42 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Goradia Prerna |
| Total patents | 42 |
| First publication | Feb 11, 2016 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Halogen resistant coatings and methods of making and using thereof
US-12497692-B2 · Dec 16, 2025 · US
Selective molecular layer deposition of organic and hybrid organic-inorganic layers
US-12191139-B2 · Jan 7, 2025 · US
Methods for forming impurity free metal alloy films
US-2024287678-A1 · Aug 29, 2024 · US
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US-2024284650-A1 · Aug 22, 2024 · US
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US-12004337-B2 · Jun 4, 2024 · US
Halogen resistant coatings and methods of making and using thereof
US-2023279541-A1 · Sep 7, 2023 · US
Halogen resistant coatings and methods of making and using thereof
US-11639547-B2 · May 2, 2023 · US
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US-2023077895-A1 · Mar 16, 2023 · US
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US-11547030-B2 · Jan 3, 2023 · US
Recent patents
Latest publications not already listed above.
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US-11540432-B2 · Dec 27, 2022 · US
Methods for improved polymer-copper adhesion
US-11388822-B2 · Jul 12, 2022 · US
Methods for forming impurity free metal alloy films
US-11359282-B2 · Jun 14, 2022 · US
Methods and apparatus for detection and analysis of nanoparticles from semiconductor chamber parts
US-11280717-B2 · Mar 22, 2022 · US
Methods for Improved Polymer-Copper Adhesion
US-2022071023-A1 · Mar 3, 2022 · US
Methods for forming impurity free metal alloy films
US-2022049353-A1 · Feb 17, 2022 · US
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US-2021100087-A1 · Apr 1, 2021 · US
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US-2021100141-A1 · Apr 1, 2021 · US
Methods and apparatus for semiconductor package processing
US-10515927-B2 · Dec 24, 2019 · US
Halogen resistant coatings and methods of making and using thereof
US-2019338418-A1 · Nov 7, 2019 · US
Slurry for polishing of integrated circuit packaging
US-10319601-B2 · Jun 11, 2019 · US
Methods for chemical etching of silicon
US-10177002-B2 · Jan 8, 2019 · US
Corrosion resistant coating for semiconductor process equipment
US-2018374706-A1 · Dec 27, 2018 · US
Method and Apparatus for Void Free SiN Gapfill
US-2018363133-A1 · Dec 20, 2018 · US
Selective Deposition And Etching Of Metal Pillars Using AACVD And An Electrical Bias
US-2018350604-A1 · Dec 6, 2018 · US
Aerosol Assisted CVD For Industrial Coatings
US-2018347039-A1 · Dec 6, 2018 · US
Selective Molecular Layer Deposition Of Organic And Hybrid Organic-Inorganic Layers
US-2018342388-A1 · Nov 29, 2018 · US
Methods and apparatus for semiconductor package processing
US-2018308822-A1 · Oct 25, 2018 · US
Slurry for polishing of integrated circuit packaging
US-2018277384-A1 · Sep 27, 2018 · US
Slurry and Slurry Delivery Technique for Chemical Mechanical Polishing of Copper
US-2018236633-A1 · Aug 23, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 40 |
| Varian Semiconductor Equipment Ass Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01J37/32477 | 12 |
| C23C16/18 | 12 |
| H10P72/7616 | 9 |
| H10P72/7602 | 8 |
| H05F1/02 | 8 |