Heat flux micro coolers having multi-stepped features and fluid wicking

Patent metadata

Field	Value
Publication number	US-11729951-B2
Application number	US-202217575071-A
Country	US
Kind code	B2
Filing date	Jan 13, 2022
Priority date	Jan 13, 2022
Publication date	Aug 15, 2023
Grant date	Aug 15, 2023

Abstract

A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

First claim

What is claimed is:

1. A cooler device comprising:
a cold plate comprising:
an array of bonding posts, each bonding post of the array of bonding posts having a first height; and
an array of fluid channels having a second height that is less than the first height, the array of bonding posts is orthogonal to the array of fluid channels, and a manifold with fluid wicking structure comprising:
a plurality of spacer elements and a plurality of mesh layers, each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement, the manifold with fluid wicking structure is in contact with the array of bonding posts.

2. The cooler device of claim 1 , wherein each of the array of bonding posts include a pair of spaced apart sidewalls and an upper surface, the pair of spaced apart sidewalls separate each array of the array of fluid channels.

3. The cooler device of claim 2 , wherein a metal inverse opal structure is positioned along the pair of spaced apart sidewalls and the upper surface of the array of bonding posts of the cold plate.

4. The cooler device of claim 1 , wherein each of the array of fluid channels further comprises a trench having a trench surface, the trench surface having a seed layer that is graded in a lateral direction.

5. The cooler device of claim 4 , wherein the trench further comprises a metal inverse opal structure positioned along the trench surface.

6. The cooler device of claim 5 , wherein the metal inverse opal structure positioned along the trench surface is graded to have a plurality of larger voids at an upper portion and a plurality of smaller voids at a lower portion, the lower portion being in contact with the trench surface.

7. The cooler device of claim 1 , further comprising:
a manifold case configured to be in contact with the cold plate and encapsulate the manifold with fluid wicking structure and the array of fluid channels.

8. The cooler device of claim 7 , wherein the manifold case further comprises:
a fluid inlet;
a fluid outlet, wherein the fluid inlet is for receiving a liquid coolant into the manifold with fluid wicking structure, and the fluid outlet is for removing the liquid coolant from the manifold with fluid wicking structure; and
at least one vapor outlet, wherein the at least one vapor outlet is for removing a vapor from the manifold with fluid wicking structure.

9. The cooler device of claim 8 , wherein the fluid inlet, the manifold with fluid wicking structure, and the fluid outlet are each fluidly isolated from the at least one vapor outlet.

10. The cooler device of claim 1 , wherein the manifold with fluid wicking structure is bonded with the array of bonding posts.

11. An electronics assembly comprising:
a cooling assembly comprising:
a cold plate comprising:
an array of bonding posts, each of the bonding posts of the array of bonding posts having a first height;
an array of fluid channels having a second height that is less than the first height, the array of fluid channels having a trench with a trench surface; and
a metal inverse opal structure positioned along the trench surface of the array of fluid channels;

a manifold with fluid wicking structure comprising:
a plurality of spacer elements and a plurality of mesh layers, each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement, the manifold with fluid wicking structure is in contact with the array of bonding posts; and

a manifold case configured to be in contact with the cold plate and encapsulate the manifold with fluid wicking structure and the array of fluid channels.

12. The electronics assembly of claim 11 , wherein the array of bonding posts is orthogonal to the array of fluid channels.

13. The electronics assembly of claim 12 , wherein the metal inverse opal structure positioned along the trench surface is graded to have a plurality of larger voids at an upper portion and a plurality of smaller voids at a lower portion, the lower portion being in contact with the trench surface.

14. The electronics assembly of claim 11 , wherein each of the array of bonding posts further comprises:
a pair of spaced apart sidewalls,
an upper surface extending from and between the pair of spaced apart sidewalls.

15. The electronics assembly of claim 14 , wherein the metal inverse opal structure is positioned along each of the pair of spaced apart sidewalls and the upper surface of the array of bonding posts.

16. The electronics assembly of claim 11 , wherein the manifold case further comprises:
a fluid inlet;
a fluid outlet, wherein the fluid inlet is for receiving a liquid coolant into the manifold with fluid wicking structure, and the fluid outlet is for removing the liquid coolant from the manifold with fluid wicking structure; and
at least one vapor outlet, wherein the at least one vapor outlet is for removing a vapor from the manifold with fluid wicking structure.

17. The electronics assembly of claim 16 , wherein the fluid inlet, the manifold with fluid wicking structure, and the fluid outlet are each fluidly isolated from the at least one vapor outlet.

18. The electronics assembly of claim 11 , wherein the manifold with fluid wicking structure is bonded with the array of bonding posts.

19. An assembly comprising:
a cooling assembly comprising:
a cold plate having a bonding area and a support member, the support member comprising:
an array of bonding posts, each of the bonding posts of the array of bonding posts comprise a pair of spaced apart sidewalls and an upper surface extending between and from the pair of spaced apart sidewalls, the array of bonding posts having a first height;
an array of fluid channels having a trench with a trench surface, the array of fluid channels having a second height that is less than the first height; and
a metal inverse opal structure positioned along the pair of spaced apart sidewalls of each of the array of bonding posts and the trench surface of each of the array of fluid channels;

a manifold with fluid wicking structure comprising:
a plurality of spacer elements and a plurality of mesh layers, each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement, the manifold with fluid wicking structure is in contact with the array of bonding posts; and

a manifold case configured to be in contact with the bonding area of the cold plate and encapsulate the manifold with fluid wicking structure and the support member.

20. The assembly of claim 19 , wherein the metal inverse opal structure positioned along the trench surface is graded to have a plurality of larger voids at an upper portion and a plurality of smaller voids at a lower portion, the lower portion being in contact with the trench surface.

Assignees

• Toyota Eng & Mfg North America
• Univ Leland Stanford Junior
• The Regents Of The Univ Of California Merced
• Alliance Sustainable Energy

Inventors

• Zhang Chi
• Wu Qianying
• Shattique Muhammad
• Seyedhassantehrani Neda
• Roy Souvik
• Palko James
• Narumanchi Sreekant
• Kekelia Bidzina
• Hazra Sougata
• Goodson Kenneth E
• Giglio Roman
• Dede Ercan M
• Asheghi Mehdi

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H05K7/20327 Primary

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title