Extreme ultraviolet (euv) activated underlayer
US-2025385101-A1 · Dec 18, 2025 · US
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Fung Nancy patents
Fung Nancy is listed as an inventor on 39 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fung Nancy |
| Total patents | 39 |
| First publication | Jan 19, 2017 |
| Latest publication | Dec 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Underlayer with fluorine for extreme ultraviolet (euv) lithography
US-2025385093-A1 · Dec 18, 2025 · US
Method of metal oxide infiltration into photoresist
US-12486559-B2 · Dec 2, 2025 · US
Selective chemical method for contact hole shrinking
US-2025329531-A1 · Oct 23, 2025 · US
Underlayer treatment for improved photoresist adhesion
US-2025258433-A1 · Aug 14, 2025 · US
Methods for etching structures with oxygen pulsing
US-12374557-B2 · Jul 29, 2025 · US
Selective deposition of carbon on photoresist layer for lithography applications
US-2025226221-A1 · Jul 10, 2025 · US
Dry development for metal-oxide photo resists
US-2025180987-A1 · Jun 5, 2025 · US
Selective deposition of carbon on photoresist layer for lithography applications
US-12283484-B2 · Apr 22, 2025 · US
Selective deposition of carbon on photoresist layer for lithography applications
US-12249509-B2 · Mar 11, 2025 · US
Recent patents
Latest publications not already listed above.
Euv sensitive metal oxide material as underlayer for thin car to improve pattern transfer
US-2024319603-A1 · Sep 26, 2024 · US
Selective deposition of carbon on photoresist layer for lithography applications
US-2023377890-A1 · Nov 23, 2023 · US
Selective deposition of carbon on photoresist layer for lithography applications
US-11776811-B2 · Oct 3, 2023 · US
Selective anisotropic metal etch
US-11658043-B2 · May 23, 2023 · US
Methods for etching structures and smoothing sidewalls
US-11658042-B2 · May 23, 2023 · US
Multicolor approach to DRAM STI active cut patterning
US-11638374-B2 · Apr 25, 2023 · US
Methods for etching structures with oxygen pulsing
US-2023072732-A1 · Mar 9, 2023 · US
Method of metal oxide infiltration into photoresist
US-2023002878-A1 · Jan 5, 2023 · US
Methods for etching structures with oxygen pulsing
US-11527414-B2 · Dec 13, 2022 · US
Patterning scheme to improve euv resist and hard mask selectivity
US-2022367186-A1 · Nov 17, 2022 · US
Patterning scheme to improve EUV resist and hard mask selectivity
US-11437238-B2 · Sep 6, 2022 · US
Multicolor Approach To DRAM STI Active Cut Patterning
US-2022238531-A1 · Jul 28, 2022 · US
Multicolor approach to DRAM STI active cut patterning
US-11335690-B2 · May 17, 2022 · US
Selective anisotropic metal etch
US-2022068661-A1 · Mar 3, 2022 · US
Methods for etching structures and smoothing sidewalls
US-2022059365-A1 · Feb 24, 2022 · US
Methods for etching structures with oxygen pulsing
US-2022059366-A1 · Feb 24, 2022 · US
Selective deposition of carbon on photoresist layer for lithography applications
US-2022005688-A1 · Jan 6, 2022 · US
Selective deposition of carbon on photoresist layer for lithography applications
US-2021358751-A1 · Nov 18, 2021 · US
Multicolor Approach To DRAM STI Active Cut Patterning
US-2021134807-A1 · May 6, 2021 · US
Diamond-like carbon as mandrel
US-10954129-B2 · Mar 23, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 37 |
| Microsoft Technology Licensing Llc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P76/4085 | 21 |
| H10P76/405 | 21 |
| H10P14/6902 | 15 |
| H10P50/73 | 15 |
| H01L21/0337 | 13 |