Multicolor approach to DRAM STI active cut patterning

Patent metadata

Field	Value
Publication number	US-11335690-B2
Application number	US-202117147001-A
Country	US
Kind code	B2
Filing date	Jan 12, 2021
Priority date	Aug 1, 2018
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

Apparatuses and methods to provide a patterned substrate are described. A plurality of patterned and spaced first lines and carbon material lines and formed on the substrate surface by selectively depositing and etching films extending in a first direction and films extending in a second direction that crosses the first direction to pattern the underlying structures.

First claim

What is claimed is:

1. A method of forming an electronic device, the method comprising:
forming a carbon gapfill material between a plurality of first lines and a plurality of second lines, the plurality of first lines comprising a first spacer material extending along a first direction, the plurality of second lines comprising a second spacer material extending along the first direction, the second lines arranged on either side of the plurality of first lines with the carbon gapfill material between the first lines and second lines;
forming an oxide layer on a top surface of the first spacer material, the second spacer material and the carbon gapfill material;
forming a plurality of spaced third lines of a third spacer material in a second direction different from the first direction so that the third spacer lines cross the first spacer lines and the carbon gapfill material; and
forming lines of fourth spacer material on either side of the spaced third material lines leaving a trench between adjacent fourth spacer material lines exposing a top surface of the oxide layer, the trench extending along the second direction.

2. The method of claim 1 , wherein forming the carbon gapfill material comprises depositing a flowable film to fill the trench with carbon gapfill material.

3. The method of claim 1 , wherein forming the carbon gapfill material comprises a conformal gapfill process to fill a trench between the first spacer material and second spacer material with the carbon gapfill material and form a carbon line extending along the first direction and an overburden carbon material with an opening aligned with the carbon gapfill material in the filled trench.

4. The method of claim 3 , further comprising filling the opening in the overburden carbon material with a spin-on-carbon (SOC) layer.

5. The method of claim 4 , further comprising removing the SOC layer and the overburden carbon material to expose a top surface of the first spacer material, the second spacer material and the carbon gapfill material.

6. The method of claim 5 , wherein the carbon material comprises a diamond-like carbon.

7. The method of claim 6 , wherein the diamond-like carbon has one or more of a stress less than or equal to −500 MPa, a density greater than or equal to 1.8 g/cc or modulus greater than or equal to 150 GPa.

8. The method of claim 6 , wherein the carbon material is formed by a chemical vapor deposition or plasma-enhanced chemical vapor deposition process using a gapfill precursor.

9. The method of claim 8 , wherein the gapfill precursor comprises a hydrocarbon.

10. The method of claim 9 , wherein the hydrocarbon is selected from a group consisting of: C 2 H 2 , C 3 H 6 , CH 4 , C 4 H 8 , 1,3-dimethyladamantane, bicyclo[2.2.1]hepta-2,5-diene (2,5-Norbornadiene), adamantine (C 10 H 16 ), norbornene (C 7 H 10 ), or combinations thereof.

Assignees

• Applied Materials Inc

Inventors

• Singh Tejinder
• Koshizawa Takehito
• Mallick Abhijit Basu
• Manna Pramit
• Fung Nancy
• Venkatasubramanian Eswaranand
• Hwang Ho-Yung David
• Gottheim Samuel E

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P14/6336

  in the presence of a plasma [PECVD] · CPC title

• H10P14/6902 Primary

  composed of carbon, e.g. alpha-C, diamond or hydrogen doped carbon · CPC title

• H01L27/10844 Primary

  Electricity · mapped topic

• H10B12/01 Primary

  Manufacture or treatment · CPC title