Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition
US-12545863-B2 · Feb 10, 2026 · US
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Fukuda Takuya patents
Fukuda Takuya is listed as an inventor on 80 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fukuda Takuya |
| Total patents | 80 |
| First publication | Apr 9, 2015 |
| Latest publication | Feb 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling
US-12534693-B2 · Jan 27, 2026 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition
US-12529018-B2 · Jan 20, 2026 · US
Release agent composition for photoirradiation release, laminate, and method for producing processed semiconductor substrate
US-2026011598-A1 · Jan 8, 2026 · US
Friction stir joining device, method of operating the same and joint structure
US-12496655-B2 · Dec 16, 2025 · US
Method for producing processed semiconductor substrate
US-2025376645-A1 · Dec 11, 2025 · US
Joining method and joined body
US-12454024-B2 · Oct 28, 2025 · US
Friction stir tool control method and friction stir device
US-2025326048-A1 · Oct 23, 2025 · US
Method for controlling friction stir welding device, and friction stir welding device
US-12447551-B2 · Oct 21, 2025 · US
Friction stir spot welded joint and production method therefor, and friction stir spot welding method
US-12434327-B2 · Oct 7, 2025 · US
Recent patents
Latest publications not already listed above.
Friction stir tool control method and friction stir device
US-12370621-B2 · Jul 29, 2025 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling composition
US-2025153225-A1 · May 15, 2025 · US
Releasability-imparting agent, adhesive composition, laminate, and method for producing semiconductor substrate
US-2025109325-A1 · Apr 3, 2025 · US
Friction stir spot welded joint and production method therefor, and friction stir spot welding method
US-2025065438-A1 · Feb 27, 2025 · US
Friction stir joining device, method of operating the same and joint structure
US-2025058403-A1 · Feb 20, 2025 · US
Friction stir joining device, method of operating the same and joint structure
US-12168261-B2 · Dec 17, 2024 · US
Friction stir spot welded joint and production method therefor, and friction stir spot welding method
US-2024351133-A1 · Oct 24, 2024 · US
Composition, thermoplastic resin composition using same, and molded article of same
US-12122899-B2 · Oct 22, 2024 · US
Adhesive composition for infrared peeling, laminate, method for producing laminate, and peeling method
US-2024301263-A1 · Sep 12, 2024 · US
Friction stir tool control method and friction stir device
US-2024293889-A1 · Sep 5, 2024 · US
Joining system, and method for operating same
US-12064831-B2 · Aug 20, 2024 · US
Composition, thermoplastic resin composition using same, and molded article thereof
US-12024622-B2 · Jul 2, 2024 · US
Joining method and joined body
US-2024207968-A1 · Jun 27, 2024 · US
Adhesive composition, laminate, method for producing laminate, and method for producing semiconductor substrate
US-2024182766-A1 · Jun 6, 2024 · US
Method for controlling friction stir welding device, and friction stir welding device
US-2024116129-A1 · Apr 11, 2024 · US
Additive composition, resin composition, method for producing resin composition, and molded article
US-2024043655-A1 · Feb 8, 2024 · US
Laminate, method for manufacturing laminate, and method for manufacturting semiconductor substrate
US-2024006221-A1 · Jan 4, 2024 · US
Dissimilar metal welding method
US-11839929-B2 · Dec 12, 2023 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition
US-2023151306-A1 · May 18, 2023 · US
Method for manufacturing semiconductor substrate, method for manufacturing processed semiconductor substrate, and release composition
US-2023151307-A1 · May 18, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kawasaki Heavy Ind Ltd | 34 |
| Nissan Chemical Corp | 19 |
| Adeka Corp | 17 |
| Yaskawa Electric Corp | 7 |
| Jfe Steel Corp | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B23K20/123 | 21 |
| B23K20/1265 | 20 |
| C09J183/04 | 18 |
| B23K20/125 | 18 |
| C08K5/527 | 17 |