Resin sheet, laminated board, metal-clad laminated board, printed wiring board, and semiconductor package
US-2025236723-A1 · Jul 24, 2025 · US
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Fujimoto Daisuke patents
Fujimoto Daisuke is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fujimoto Daisuke |
| Total patents | 28 |
| First publication | Jan 19, 2017 |
| Latest publication | Jul 24, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
US-2025234456-A1 · Jul 17, 2025 · US
Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring member
US-2025159815-A1 · May 15, 2025 · US
Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring member
US-2025142722-A1 · May 1, 2025 · US
Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package
US-12264224-B2 · Apr 1, 2025 · US
Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
US-12256490-B2 · Mar 18, 2025 · US
Wiring-forming member, wiring layer forming method using wiring-forming member, and wiring-formed member
US-2025024609-A1 · Jan 16, 2025 · US
Electroconductive member, method for manufacturing electronic device, connection structure, and electronic device
US-2024079345-A1 · Mar 7, 2024 · US
Method for evaluating compatibility of thermosetting resin composition, thermosetting resin composition, prepreg, resin film, laminated plate, multilayer printed wiring board, and semiconductor package
US-2023392002-A1 · Dec 7, 2023 · US
Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device
US-11795293-B2 · Oct 24, 2023 · US
Recent patents
Latest publications not already listed above.
Method for using a buffer sheet
US-2023095879-A1 · Mar 30, 2023 · US
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Multilayer Printed Wiring Board, and Semiconductor Package
US-2022363850-A1 · Nov 17, 2022 · US
Refrigerant cycle system
US-2022243962-A1 · Aug 4, 2022 · US
Resin composition, resin member, resin sheet, b-stage sheet, c-stage sheet, metal foil with resin, metal substrate, and power semiconductor device
US-2021206906-A1 · Jul 8, 2021 · US
Method for producing semiconductor device
US-11049825-B2 · Jun 29, 2021 · US
Epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, c-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device
US-2021016546-A1 · Jan 21, 2021 · US
Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
US-2020404783-A1 · Dec 24, 2020 · US
On-chip monitor circuit and semiconductor chip
US-10776484-B2 · Sep 15, 2020 · US
Method for producing semiconductor device
US-2020194391-A1 · Jun 18, 2020 · US
Roof ditch molding end cap
US-10464502-B2 · Nov 5, 2019 · US
Roof ditch molding end cap
US-2019232890-A1 · Aug 1, 2019 · US
Buffer sheet composition and buffer sheet
US-2018340056-A1 · Nov 29, 2018 · US
Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
US-10034384-B2 · Jul 24, 2018 · US
Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
US-9873771-B2 · Jan 23, 2018 · US
On-chip monitor circuit and semiconductor chip
US-2018004944-A1 · Jan 4, 2018 · US
Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
US-9661763-B2 · May 23, 2017 · US
Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
US-2017073481-A1 · Mar 16, 2017 · US
Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
US-2017020004-A1 · Jan 19, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Chemical Co Ltd | 12 |
| Resonac Corp | 9 |
| Showa Denko Materials Co Ltd | 6 |
| Univ Kobe Nat Univ Corp | 2 |
| Telecom Paristech | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08J5/18 | 12 |
| C08J2363/00 | 8 |
| C08L63/00 | 8 |
| C08J5/24 | 7 |
| C08K3/36 | 7 |