Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device

Patent metadata

Field	Value
Publication number	US-9873771-B2
Application number	US-201514894645-A
Country	US
Kind code	B2
Filing date	Jun 3, 2015
Priority date	Jun 4, 2014
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

A film-like epoxy resin composition includes an epoxy resin (A); a curing agent (B); a cure accelerator (C);an inorganic filler (D); and an organic solvent (E). The film-like epoxy resin composition satisfies all the following requirements (1) to (4): (1) at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25° C. in an amount of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B); (2) the content of a volatile portion that volatilizes by being heated at 180° C. for 10 minutes is 0.2% to 1.5% by mass based on the total amount of the epoxy resin composition; (3) the minimum melt viscosity in temperature rising from 40° C. to 200° C. is 800 Pa·s or less; and (4) the film thickness is 50 to 500 μm.

First claim

The invention claimed is:

1. A film-like epoxy resin composition comprising:
an epoxy resin (A);
a curing agent (B);
a cure accelerator (C);
an inorganic filler (D); and
an organic solvent (E), and

satisfying all the following requirements (1) to (4):
(1) at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25° C. in an amount of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B);
(2) a content of a volatile portion that volatilizes by being heated at 180° C. for 10 minutes is 0.2% to 1.5% by mass based on the total amount of the epoxy resin composition;
(3) a minimum melt viscosity in temperature rising from 40° C. to 200° C. is 800 Pa·s or less; and
(4) a film thickness is 50 to 500 μm.

2. The film-like epoxy resin composition according to claim 1 , wherein the film-like epoxy resin composition includes no interface that is formed by bonding two or more sheets of a film-like epoxy resin composition.

3. The film-like epoxy resin composition according to claim 1 , having a ratio of the content of the organic solvent (E) in one surface of the film-like epoxy resin composition to that in the other surface of 0.2 to 5.0, where each content is calculated based on the absorption of the organic solvent (E) measured by FT-IR (total reflection method) of both surfaces of the film-like epoxy resin composition.

4. A method of producing a film-like epoxy resin composition, comprising the steps of:
forming a coating film of a varnish-like epoxy resin composition containing an epoxy resin (A), a curing agent (B), a cure accelerator (C), an inorganic filler (D), and an organic solvent (E) and satisfying a requirement (1) on a support; and
drying the coating film with heat to form a film-like epoxy resin composition satisfying all of requirements (2) to (4),
requirement (1): at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25° C. in an amount of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B);
requirement (2): a content of a volatile portion that volatilizes by being heated at 180° C. for 10 minutes is 0.2% to 1.5% by mass based on the total amount of the epoxy resin composition;
requirement (3): a minimum melt viscosity in temperature rising from 40° C. to 200° C. is 800 Pa·s or less; and
requirement (4): a film thickness is 50 to 500 μm.

5. The method of producing a film-like epoxy resin composition according to claim 4 , wherein
the heat drying of the coating film includes heating of the coating film for a period of time of 25% or more of the total drying time at a temperature within a range of ±10° C. of the boiling point of the component (E).

6. The method of producing a film-like epoxy resin composition according to claim 4 , wherein
the coating film is dried with heat such that the ratio of the content of the organic solvent (E) in one surface of the film-like epoxy resin composition to that in the other surface is 0.2 to 5.0, where each content is calculated based on the absorption of the organic solvent (E) measured by FT-IR (total reflection method) of both surfaces of the film-like epoxy resin composition.

7. A sealing sheet comprising of:
a film-like support; and
the film-like epoxy resin composition according to claim 1 disposed on the support.

8. A method of producing a semiconductor device, comprising the steps of:
pressing the film-like epoxy resin composition according to claim 1 to a semiconductor element while heating to embed the semiconductor element in the film-like epoxy resin composition; and
curing the film-like epoxy resin composition embedding the semiconductor element.

9. A method of producing an electronic component device, comprising the steps of:
pressing the film-like epoxy resin composition according to claim 1 to an electronic component while heating to embed the electronic component in the film-like epoxy resin composition; and
curing the film-like epoxy resin composition embedding the electronic component.

10. A semiconductor device comprising of:
a semiconductor element; and
a sealing portion, embedding the semiconductor element and being made of a cured product of the film-like epoxy resin composition according to claim 1 .

11. An electronic component device comprising of:
an electronic component; and
a sealing portion, embedding the electronic component and being made of a cured product of the film-like epoxy resin composition according to claim 1 .

12. A sealing sheet comprising of:
a film-like support; and
a film-like epoxy resin composition prepared by the method according to claim 4 disposed on the support.

13. A method of producing a semiconductor device, comprising the steps of:
pressing a film-like epoxy resin composition prepared by the method according to claim 4 to a semiconductor element while heating to embed the semiconductor element in the film-like epoxy resin composition; and
curing the film-like epoxy resin composition embedding the semiconductor element.

14. A method of producing an electronic component device, comprising the steps of:
pressing a film-like epoxy resin composition prepared by the method according to claim 4 to an electronic component while heating to embed the electronic component in the film-like epoxy resin composition; and
curing the film-like epoxy resin composition embedding the electronic component.

15. A semiconductor device comprising of:
a semiconductor element; and
a sealing portion, embedding the semiconductor element and being made of a cured product of a film-like epoxy resin composition prepared by the method according to claim 4 .

16. An electronic component device comprising of:
an electronic component; and
and a sealing portion, embedding the electronic component and being made of a cured product of a film-like epoxy resin composition prepared by the method according to claim 4 .

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Nomura Yutaka
• Watase Yusuke
• Ogihara Hirokuni
• Sakamoto Norihiko
• Fujimoto Daisuke
• Murai Hikari

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W74/473

  containing a filler · CPC title