Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition

Patent metadata

Field	Value
Publication number	US-2017020004-A1
Application number	US-201615276847-A
Country	US
Kind code	A1
Filing date	Sep 27, 2016
Priority date	Oct 11, 2011
Publication date	Jan 19, 2017
Grant date	—

Abstract

A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

First claim

1 . The method for manufacturing a structure containing a conductor circuit in which openings are provided in an insulating layer formed on a surface of a support having the conductor circuit, and a wiring portion connected to the conductor circuit is formed in the opening, the method comprising:
a first photosensitive resin layer formation process for forming a first photosensitive resin layer on the support to cover the conductor circuit; a first patterning process for patterning the first photosensitive resin layer by performing an exposure process and a developing process on the first photosensitive resin layer; a heat-curable resin layer formation process for forming a heat-curable resin layer on the support to cover the pattern of the first photosensitive resin layer; a heat-curing process for heat-curing the heat-curable resin layer as a process immediately after the heat-curable resin layer formation process; a pattern exposure process for removing a portion of the heat-curable resin layer to expose a predetermined place of the pattern of the first photosensitive resin layer from the heat-curable resin layer; and an opening formation process for removing the first photosensitive resin layer exposed from the heat-curable resin layer to form an opening exposing the conductor circuit in the heat-curable resin layer, wherein the pattern exposure process and the opening formation process include performing removal of a portion of the heat-curable resin layer after the heat curing and removal of the first photosensitive resin layer exposed from the heat-curable resin layer by performing plasma processing.

2 . The method for manufacturing a structure containing a conductor circuit in which openings are provided in an insulating layer formed on a surface of a support having the conductor circuit, and a wiring portion connected to the conductor circuit is formed in the opening, the method comprising:
a first photosensitive resin layer formation process for forming a first photosensitive resin layer on the support to cover the conductor circuit; a first patterning process for patterning the first photosensitive resin layer by performing an exposure process and a developing process on the first photosensitive resin layer; a heat-curable resin layer formation process for forming a heat-curable resin layer on the support to cover the pattern of the first photosensitive resin layer; a pattern exposure process for removing a portion of the heat-curable resin layer to expose a predetermined place of the pattern of the first photosensitive resin layer from the heat-curable resin layer; an opening formation process for removing the first photosensitive resin layer exposed from the heat-curable resin layer to form an opening exposing the conductor circuit in the heat-curable resin layer; and a heat-curing process for heat-curing the heat-curable resin layer as a process between the pattern exposure process and the opening formation process, wherein the pattern exposure process includes removing a portion of the heat-curable resin layer before the heat curing by performing plasma processing, and the opening formation process includes performing removal of the first photosensitive resin layer exposed from the heat-curable resin layer after the heat curing by performing plasma processing.

3 . The method for manufacturing a structure containing a conductor circuit in which openings are provided in an insulating layer formed on a surface of a support having the conductor circuit, and a wiring portion connected to the conductor circuit is formed in the opening, the method comprising:
a first photosensitive resin layer formation process for forming a first photosensitive resin layer on the support to cover the conductor circuit; a first patterning process for patterning the first photosensitive resin layer by performing an exposure process and a developing process on the first photosensitive resin layer; a heat-curable resin layer formation process for forming a heat-curable resin layer on the support to cover the pattern of the first photosensitive resin layer; a pattern exposure process for removing a portion of the heat-curable resin layer to expose a predetermined place of the pattern of the first photosensitive resin layer from the heat-curable resin layer; an opening formation process for removing the first photosensitive resin layer exposed from the heat-curable resin layer to form an opening exposing the conductor circuit in the heat-curable resin layer; a heat-curing process for heat-curing the heat-curable resin layer as a process after the opening formation process, wherein the pattern exposure process and the opening formation process include performing removal of a portion of the heat-curable resin layer before the heat curing and removal of the first photosensitive resin layer exposed from the heat-curable resin layer by performing plasma processing.

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Kurafuchi Kazuhiko
• Fujimoto Daisuke
• Yamada Kunpei
• Nagoshi Toshimasa

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H05K3/06 Primary

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title