Methods of cross-section imaging of an inspection volume in a wafer
US-12557588-B2 · Feb 17, 2026 · US
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Foca Eugen patents
Foca Eugen is listed as an inventor on 42 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Foca Eugen |
| Total patents | 42 |
| First publication | Jun 15, 2017 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
3d volume inspection method and method of configuring of a 3d volume inspection method
US-2025362253-A1 · Nov 27, 2025 · US
Methods of cross-section imaging of an inspection volume in a wafer
US-2025357165-A1 · Nov 20, 2025 · US
Sensor fusion for thin film segmentation
US-2025272946-A1 · Aug 28, 2025 · US
Contact area size determination between 3d structures in an integrated semiconductor sample
US-2025239474-A1 · Jul 24, 2025 · US
Computer implemented method for defect detection in an imaging dataset of a wafer, corresponding computer-readable medium, computer program product and systems making use of such methods
US-2025216842-A1 · Jul 3, 2025 · US
Method for distortion measurement and parameter setting for charged particle beam imaging devices and corresponding devices
US-2025166962-A1 · May 22, 2025 · US
Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods
US-12293895-B2 · May 6, 2025 · US
Parameterizing x-ray scattering measurement using slice-and-image tomographic imaging of semiconductor structures
US-12288706-B2 · Apr 29, 2025 · US
FIB-SEM 3D tomography for measuring shape deviations of HAR structures
US-12288705-B2 · Apr 29, 2025 · US
Recent patents
Latest publications not already listed above.
Contact area size determination between 3D structures in an integrated semiconductor sample
US-12283504-B2 · Apr 22, 2025 · US
Dual beam systems and methods for decoupling the working distance of a charged particle beam device from focused ion beam geometry induced constraints
US-2025069958-A1 · Feb 27, 2025 · US
3d volume inspection of semiconductor wafers with increased throughput and accuracy
US-2025022680-A1 · Jan 16, 2025 · US
Method of 3d volume inspection of semiconductor wafers with increased throughput
US-2024328970-A1 · Oct 3, 2024 · US
3d volume inspection of semiconductor wafers with increased accuracy
US-2024331179-A1 · Oct 3, 2024 · US
Measurement method and apparatus for semiconductor features with increased throughput
US-2024311698-A1 · Sep 19, 2024 · US
Electron microscope for examining a specimen
US-2024302304-A1 · Sep 12, 2024 · US
3d volume inspection method and method of configuring of a 3d volume inspection method
US-2024281952-A1 · Aug 22, 2024 · US
Automated root cause analysis for defect detection during fabrication processes of semiconductor structures
US-12045969-B2 · Jul 23, 2024 · US
Method for measuring a sample and microscope implementing the method
US-11915908-B2 · Feb 27, 2024 · US
Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods
US-2024038482-A1 · Feb 1, 2024 · US
Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods
US-11810749-B2 · Nov 7, 2023 · US
Parameterizing x-ray scattering measurement using slice-and-image tomographic imaging of semiconductor structures
US-2023343619-A1 · Oct 26, 2023 · US
Transferring alignment information in 3d tomography from a first set of images to a second set of images
US-2023267627-A1 · Aug 24, 2023 · US
Measurement method and apparatus for semiconductor features with increased throughput
US-2023196189-A1 · Jun 22, 2023 · US
Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods
US-2023178327-A1 · Jun 8, 2023 · US
Method for measuring a sample and microscope implementing the method
US-2023120847-A1 · Apr 20, 2023 · US
Methods of cross-section imaging of an inspection volume in a wafer
US-2022392793-A1 · Dec 8, 2022 · US
Method and devices for determining metrology sites
US-11436506-B2 · Sep 6, 2022 · US
Contact area size determination between 3d structures in an integrated semiconductor sample
US-2022230899-A1 · Jul 21, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Zeiss Carl Smt Gmbh | 42 |
| Carl Zeiss Smt Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06T2207/30148 | 19 |
| G06T7/0004 | 18 |
| H01J37/28 | 14 |
| G06T2207/10061 | 14 |
| H01J37/222 | 13 |