Chip package device
US-2026090441-A1 · Mar 26, 2026 · US
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Fallourd Ludovic patents
Fallourd Ludovic is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fallourd Ludovic |
| Total patents | 23 |
| First publication | Mar 8, 2018 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing an electronic chip having an electromagnetic shielding
US-2025329663-A1 · Oct 23, 2025 · US
Method of fabricating electronic chips
US-2025239481-A1 · Jul 24, 2025 · US
Method for manufacturing electronic components
US-2025239505-A1 · Jul 24, 2025 · US
Method of fabricating electronic chips
US-2025191977-A1 · Jun 12, 2025 · US
Method of manufacturing electronic components with wettable flanks
US-2025174588-A1 · May 29, 2025 · US
Method for manufacturing electronic chips
US-12230602-B2 · Feb 18, 2025 · US
Method for singulating chips with laterally insulated flanks
US-11923234-B2 · Mar 5, 2024 · US
Manufacturing of electronic components
US-2023230906-A1 · Jul 20, 2023 · US
Method for manufacturing electronic chips
US-2022344303-A1 · Oct 27, 2022 · US
Recent patents
Latest publications not already listed above.
Method for manufacturing electronic chips
US-11393786-B2 · Jul 19, 2022 · US
Method for manufacturing electronic chips
US-11393785-B2 · Jul 19, 2022 · US
Battery assembly
US-11367913-B2 · Jun 21, 2022 · US
Method for manufacturing electronic chips
US-2021175204-A1 · Jun 10, 2021 · US
Method for manufacturing electronic chips
US-2021175203-A1 · Jun 10, 2021 · US
Method for manufacturing electronic chips
US-2021151347-A1 · May 20, 2021 · US
Encapsulated microbattery having terminal connected to active layer through a via
US-10637013-B2 · Apr 28, 2020 · US
Battery assembly
US-2019252649-A1 · Aug 15, 2019 · US
Encapsulated microbattery having terminal connected to active layer through a via
US-10236480-B2 · Mar 19, 2019 · US
Encapsulated microbattery having terminal connected to active layer through a via
US-2018331332-A1 · Nov 15, 2018 · US
Encapsulated microbattery having terminal connected to active layer through a via
US-2018315965-A1 · Nov 1, 2018 · US
Encapsulated microbattery having terminal connected to active layer through a via
US-10044009-B2 · Aug 7, 2018 · US
Encapsulated microbattery having terminal connected to active layer through a via
US-2018069206-A1 · Mar 8, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| St Microelectronics Tours Sas | 17 |
| St Microelectronics Int Nv | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P54/00 | 13 |
| H10W74/129 | 13 |
| H10W74/014 | 13 |
| H10P72/7416 | 12 |
| H10W72/0198 | 11 |