Electronic printed circuit board assembly for high-power components
US-11272617-B2 · Mar 8, 2022 · US
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Edlinger Erik patents
Edlinger Erik is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Edlinger Erik |
| Total patents | 12 |
| First publication | Nov 16, 2017 |
| Latest publication | Mar 8, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for producing a printed circuit board having thermal through-contacts
US-11116071-B2 · Sep 7, 2021 · US
Electronic Printed Circuit Board Assembly for High-Power Components
US-2021092846-A1 · Mar 25, 2021 · US
Method for void reduction in solder joints
US-10843284-B2 · Nov 24, 2020 · US
Method for Producing a Printed Circuit Board Having Thermal Through-Contacts, and Printed Circuit Board
US-2020236775-A1 · Jul 23, 2020 · US
Component cooling device
US-10638637-B2 · Apr 28, 2020 · US
Headlamp for vehicles having at least one laser light source
US-10408403-B2 · Sep 10, 2019 · US
Printed circuit board and method for producing a printed circuit board
US-10327325-B2 · Jun 18, 2019 · US
Component cooling device
US-2019132988-A1 · May 2, 2019 · US
Printed circuit board and method for producing a printed circuit board
US-2018199425-A1 · Jul 12, 2018 · US
Recent patents
Latest publications not already listed above.
Method for void reduction in solder joints
US-2018093338-A1 · Apr 5, 2018 · US
Headlamp for vehicles having at least one laser light source
US-2017328532-A1 · Nov 16, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Zkw Group Gmbh | 12 |
| ZK W Group GmbH | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/0206 | 6 |
| H05K1/181 | 6 |
| H05K2203/0455 | 4 |
| H05K2203/045 | 4 |
| H05K2203/042 | 4 |