Component cooling device

Patent metadata

Field	Value
Publication number	US-10638637-B2
Application number	US-201716092804-A
Country	US
Kind code	B2
Filing date	Apr 5, 2017
Priority date	Apr 13, 2016
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

A component cooling device (101) comprising: a circuit board (102), the circuit board (102) having an upper side (103) and a lower side (104) facing away from the upper side (103); and at least one electronic component (106) and at least one hollow circuit board opening (107) for a gaseous cooling medium for cooling the component, wherein on the lower side (104) of the circuit board (102) is provided a guide (110) which forms a flow channel (109) that has at least one inlet (113) and at least one outlet, which is formed by the at least one circuit board opening (107), for at least one convection flow (108) of the cooling medium.

First claim

The invention claimed is:

1. A component cooling device ( 101 , 201 , 301 , 401 , 501 ) comprising:
a circuit board ( 102 , 202 , 302 , 402 , 502 ), the circuit board ( 102 , 202 , 302 , 402 , 502 ) having an upper side ( 103 , 203 , 303 , 403 , 503 ) and a lower side ( 104 , 204 , 304 , 404 , 504 ) facing away from the upper side ( 103 , 203 , 303 , 403 , 503 ); and
at least one electronic component ( 6 , 106 , 206 , 306 , 406 , 506 ) and at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ) for a gaseous cooling medium for cooling the at least one electronic component,
wherein on the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ) is provided a guide ( 10 , 110 , 210 , 310 , 410 , 510 ) which forms a flow channel ( 109 , 209 , 309 , 409 , 509 ) for a convection flow of the gaseous cooling medium,
wherein the guide has at least one inlet ( 13 , 113 , 213 , 313 , 413 , 513 ) and at least one outlet which is formed by the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ), and
wherein the at least one inlet ( 13 , 113 , 213 , 313 , 413 , 513 ) has a cross-section which is decreasing to a smaller cross-section of the at least one outlet.

2. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the flow channel ( 109 , 209 , 309 , 409 , 509 ) is delimited by the guide ( 10 , 110 , 210 , 310 , 410 , 510 ) and a region of the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ), wherein the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ) is likewise arranged in this region.

3. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein a region of the flow channel ( 109 , 209 , 309 , 409 , 509 ) on the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ) comprises at least one cooling area ( 111 , 311 ), wherein the at least one cooling area ( 111 , 311 ) is delimited substantially by a contour ( 311 a ) of the at least one electronic component ( 6 , 106 , 206 , 306 , 406 , 506 ) on the circuit board ( 102 , 202 , 302 , 402 , 502 ) and is arranged on the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ).

4. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the at least one inlet ( 13 , 113 , 213 , 313 , 413 , 513 ) of the flow channel ( 109 , 209 , 309 , 409 , 509 ) has a rectangular shape, and the flow channel ( 109 , 209 , 309 , 409 , 509 ) has a height ( 114 ) transversely to the circuit board ( 102 , 202 , 302 , 402 , 502 ) that decreases from the at least one inlet ( 13 , 113 , 213 , 313 , 413 , 513 ) to the at least one outlet.

5. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the guide ( 10 , 110 , 210 , 310 , 410 , 510 ) is formed from three adjoining side walls ( 15 , 115 , 215 , 315 , 415 , 515 ) and an adjoining end face ( 16 , 116 , 216 , 316 , 416 , 516 ) and the guide ( 10 , 110 , 210 , 310 , 410 , 510 ), jointly with the region of the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ) and the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ), forms the flow channel ( 109 , 209 , 309 , 409 , 509 ).

6. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein at least one contact connection area ( 105 a , 205 a , 305 a , 405 a , 505 a , 105 b , 205 b , 305 b , 405 b , 505 b ) on the upper side ( 103 , 203 , 303 , 403 , 503 ) is connected to at least one heat radiation area ( 105 c , 205 c , 305 c , 305 d , 405 c , 505 c ) on the lower side ( 104 , 204 , 304 , 404 , 504 ) by at least one hollow, electrically conductive circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ).

7. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the circuit board ( 102 , 202 , 302 , 402 , 502 ) is formed in one layer and has metal layers on both sides.

8. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein at least one thermal chimney structure ( 418 ) for intensifying the at least one convection flow ( 108 , 208 , 408 ) is arranged on the upper side ( 103 , 203 , 303 , 403 , 503 ) and the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ) leads out into the at least one thermal chimney structure ( 418 ).

9. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 8 , wherein the at least one thermal chimney structure ( 418 ) has a chimney height and a chimney diameter and the chimney height ( 419 ) is greater than the diameter of the hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ), wherein the chimney diameter ( 420 ) corresponds substantially to the diameter of the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ).

10. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 8 , wherein the at least one thermal chimney structure has a chimney height and a chimney diameter and the chimney diameter ( 420 ) at least in part extends in a non-constant manner along the chimney height ( 419 ) or, at one end of the at least one thermal chimney structure ( 418 ) at which a solder connection ( 418 a ) is provided, extends in a widening manner.

11. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 8 , wherein a plurality of chimney structures ( 418 ) are arranged in a row upstream or downstream of the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ) and are made of different materials, which are designed to be mechanically rigid or elastically malleable and jointly form a combined chimney structure.

12. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 11 , wherein the combined chimney structure is connected to at least one further component of a vehicle headlamp.

13. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the circuit board ( 102 , 202 , 302 , 402 , 502 ) in an installed position in a vehicle headlamp is oriented substantially horizontally, with an angle of the circuit board ( 102 , 202 , 302 , 402 , 502 ) to the horizontal in the range of −45° to +45°.

14. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the component cooling device ( 101 , 201 , 301 , 401 , 501 ) is arranged within a vehicle headlamp and is designed to cool a light source for a main beam light source or a dipped beam light source.

15. A vehicle headlamp having one or more light sources which can radiate light in order to produce a light distribution, with a component cooling device according to claim 1 for cooling the one or more light sources.

16. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 9 , wherein the chimney height ( 419 ) is at least five times greater than the diameter of the at least one hollow circuit boa

Assignees

• Zkw Group Gmbh

Inventors

• Edlinger Erik
• Kieslinger Dietmar
• Weber Emanuel

Classifications

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K2201/09609

  Via grid, i.e. two-dimensional array of vias or holes in a single plane · CPC title

• H05K7/20145 Primary

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• H05K1/0206

  by printed thermal vias · CPC title

• H05K7/20845

  for automotive electronic casings (H05K7/2089 takes precedence) · CPC title