Integrated circuit including standard cell and method of designing the integrated circuit
US-12591726-B2 · Mar 31, 2026 · US
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Do Jungho patents
Do Jungho is listed as an inventor on 62 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Do Jungho |
| Total patents | 62 |
| First publication | Aug 29, 2019 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit including standard cells and method of designing the same
US-2026033010-A1 · Jan 29, 2026 · US
Integrated circuit including standard cells and method of designing the same
US-12453184-B2 · Oct 21, 2025 · US
Integrated circuit device including normal cells and through via supplying backside power to frontside power gating cell
US-12406904-B2 · Sep 2, 2025 · US
Integrated circuit providing increased pin access points and method of designing the same
US-2025272468-A1 · Aug 28, 2025 · US
Cooling device semiconductor device including end curved interconnection lines
US-12389676-B2 · Aug 12, 2025 · US
Integrated circuit providing increased pin access points and method of designing the same
US-12307185-B2 · May 20, 2025 · US
Semiconductor devices
US-2025087586-A1 · Mar 13, 2025 · US
Semiconductor device
US-2024413151-A1 · Dec 12, 2024 · US
Semiconductor devices
US-12159834-B2 · Dec 3, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor devices
US-2024395713-A1 · Nov 28, 2024 · US
Integrated circuit including backside contact and method of designing the integrated circuit
US-2024363532-A1 · Oct 31, 2024 · US
Semiconductor device
US-12131999-B2 · Oct 29, 2024 · US
Semiconductor device having active fin pattern at cell boundary
US-2024332305-A1 · Oct 3, 2024 · US
Iintegrated circuit including backside wiring and method of manufacturing the integrated circuit
US-2024290692-A1 · Aug 29, 2024 · US
Semiconductor device
US-12068315-B2 · Aug 20, 2024 · US
Integrated circuit including backside wiring and method of designing the integrated circuit
US-2024266344-A1 · Aug 8, 2024 · US
Semiconductor device
US-2024250001-A1 · Jul 25, 2024 · US
Integrated circuit including backside wiring and method of designing the same
US-2024250028-A1 · Jul 25, 2024 · US
Integrated circuit including switch cell area
US-2024234294-A1 · Jul 11, 2024 · US
Semiconductor device having active fin pattern at cell boundary
US-12034008-B2 · Jul 9, 2024 · US
Integrated circuit including standard cell with a metal layer having a pattern and method of manufacturing the same
US-2024128159-A1 · Apr 18, 2024 · US
Integrated circuit including standard cells and method of designing the same
US-2024105710-A1 · Mar 28, 2024 · US
Semiconductor device
US-2024088039-A1 · Mar 14, 2024 · US
Multi-threshold integrated circuit and method of designing the same
US-2024055431-A1 · Feb 15, 2024 · US
Semiconductor device
US-11842964-B2 · Dec 12, 2023 · US
Integrated circuit including multi-height cells and method of designing the same
US-2023378156-A1 · Nov 23, 2023 · US
Semiconductor device having active fin pattern at cell boundary
US-2023335559-A1 · Oct 19, 2023 · US
Integrated circuit including standard cells and methodof designing the same
US-2023307436-A1 · Sep 28, 2023 · US
Integrated circuits including abutted blocks and methods of designing layouts of the integrated circuits
US-2023297752-A1 · Sep 21, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 62 |
| Sumsung Electronics Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D89/10 | 56 |
| H10W20/427 | 35 |
| H10D84/038 | 33 |
| H01L27/0207 | 31 |
| H10D84/85 | 30 |