Adapting electrical, mechanical, and thermal properties of package substrates
US-12094726-B2 · Sep 17, 2024 · US
Dickerson Gary E is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dickerson Gary E |
| Total patents | 13 |
| First publication | Sep 10, 2015 |
| Latest publication | Sep 17, 2024 |
Publications ranked by popularity score, then publication date.
US-12094726-B2 · Sep 17, 2024 · US
US-11781100-B2 · Oct 10, 2023 · US
US-2023187222-A1 · Jun 15, 2023 · US
US-2022177821-A1 · Jun 9, 2022 · US
US-9978620-B2 · May 22, 2018 · US
US-9773675-B2 · Sep 26, 2017 · US
US-2017271181-A1 · Sep 21, 2017 · US
US-2017154776-A1 · Jun 1, 2017 · US
US-9646893-B2 · May 9, 2017 · US
US-9620407-B2 · Apr 11, 2017 · US
Latest publications not already listed above.
US-2016276227-A1 · Sep 22, 2016 · US
US-2016163546-A1 · Jun 9, 2016 · US
US-2015255243-A1 · Sep 10, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 13 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W10/181 | 4 |
| H10P95/00 | 4 |
| H10P90/1906 | 4 |
| H10P76/4083 | 4 |
| H10P76/405 | 4 |