3D material modification for advanced processing

Patent metadata

Field	Value
Publication number	US-9773675-B2
Application number	US-201715432368-A
Country	US
Kind code	B2
Filing date	Feb 14, 2017
Priority date	Dec 8, 2014
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

Embodiments of the present disclosure relate to precision material modification of three dimensional (3D) features or advanced processing techniques. Directional ion implantation methods are utilized to selectively modify desired regions of a material layer to improve etch characteristics of the modified material. For example, a modified region of a material layer may exhibit improved etch selectivity relative to an unmodified region of the material layer. Methods described herein are useful for manufacturing 3D hardmasks which may be advantageously utilized in various integration schemes, such as fin isolation and gate-all-around, among others. Multiple directional ion implantation processes may also be utilized to form dopant gradient profiles within a modified layer to further influence etching processes.

First claim

What is claimed is:

1. A hardmask structure, comprising:
a modified film layer disposed on a fin structure, the modified film layer having a top portion disposed over the fin structure and sidewall portions that extend adjacent to sidewalls of the fin structure, the modified film layer comprising:
an outer region having a first dopant concentration;
an intermediate region having a second dopant concentration less than the first dopant concentration; and
an inner region having a third dopant concentration less than the second dopant concentration.

2. The hardmask structure of claim 1 , wherein the inner region is disposed adjacent the sidewalls of the fin structure.

3. The hardmask structure of claim 2 , wherein the intermediate region is disposed adjacent the inner region.

4. The hardmask structure of claim 3 , wherein the outer region is disposed adjacent the intermediate region.

5. The hardmask structure of claim 1 , wherein the intermediate region is disposed between the outer region and the inner region.

6. The hardmask structure of claim 1 , wherein the first dopant concentration is between about 1×10 21 ions/cm 3 and about 1×10 23 ions/cm 3 .

7. The hardmask structure of claim 6 , wherein the second dopant concentration is between about 1×10 19 ions/cm 3 and about 1×10 21 ions/cm 3 .

8. The hardmask structure of claim 7 , wherein the third dopant concentration is less than about 1×10 19 ions/cm 3 .

9. The hardmask structure of claim 8 , wherein the third dopant concentration is about 0 ions/cm 3 .

10. The hardmask structure of claim 1 , wherein the outer region, the intermediate region, and the inner region comprise an engineered feature.

11. The hardmask structure of claim 10 , wherein the engineered feature defines a notched shape.

12. The hardmask structure of claim 1 , wherein the first dopant concentration is present in the outer region of the modified film layer at a depth of up to about 10 Å.

13. The hardmask structure of claim 1 , wherein the second dopant concentration is present in the intermediate region of the modified film layer at a depth of between about 10 Å and about 20 Å.

14. The hardmask structure of claim 1 , wherein the third dopant concentration is present in the inner region of the modified film layer at a depth of between about 20 Å and about 30 Å.

15. The hardmask structure of claim 1 , wherein the top portion of the modified film structure has a density greater than a density of the sidewall portions of the modified film structure.

16. The hardmask structure of claim 1 , wherein the modified film layer comprises an insulative material selected from the group consisting of a silicon nitride containing material, an oxide containing material, an aluminum oxide containing material, an amorphous silicon containing material, a polysilicon containing material, and combinations thereof.

17. A device structure, comprising:
a silicon containing fin structure;
a modified film layer disposed on the silicon containing fin structure, the modified film layer having a top portion disposed over the silicon containing fin structure and sidewall portions that extend adjacent to sidewalls of the silicon containing fin structure, the modified film layer comprising:
an outer region having a first dopant concentration between about 1×10 21 ions/cm 3 and about 1×10 23 ions/cm 3 ;
an intermediate region having a second dopant concentration between about 1×10 19 ions/cm 3 and about 1×10 21 ions/cm 3 ; and
an inner region having a third dopant concentration less than about 1×10 19 ions/cm 3 .

18. The device structure of claim 17 , wherein the modified film layer further comprises:
an engineered feature defining a notched shape.

19. The device of claim 17 , wherein the first dopant concentration is present in the outer region of the modified film layer at a depth of up to about 10 Å, the second dopant concentration is present in the intermediate region of the modified film layer at a depth of between about 10 Å and about 20 Å, and the third dopant concentration is present in the inner region of the modified film layer at a depth of between about 20 Å and about 30 Å.

20. A device structure, comprising:
a silicon containing fin structure, wherein at least a portion of the silicon containing fin structure is oxidized;
a modified film layer disposed on the silicon containing fin structure, the modified film layer having a top portion disposed over the silicon containing fin structure and sidewall portions that extend adjacent to sidewalls of the silicon containing fin structure, the modified film layer comprising:
an outer region having a first dopant concentration between about 1×10 21 ions/cm 3 and about 1×10 23 ions/cm 3 ;
an intermediate region having a second dopant concentration between about 1×10 19 ions/cm 3 and about 1×10 21 ions/cm 3 ; and
an inner region having a third dopant concentration less than about 1×10 19 ions/cm 3 .

Assignees

• Applied Materials Inc

Inventors

• Godet Ludovic
• Nemani Srinivas D
• Chen Erica
• Xue Jun
• Yieh Ellie Y
• Dickerson Gary E

Classifications

• H10W10/181

  Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P90/1906

  Preparing SOI wafers · CPC title

• H10P76/4083

  characterised by their behaviours during the lithography processes, e.g. soluble masks or redeposited masks · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title