Methods for forming microwave tunable composited thin-film dielectric layer
US-12048948-B2 · Jul 30, 2024 · US
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Deng Felix patents
Deng Felix is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Deng Felix |
| Total patents | 11 |
| First publication | Nov 21, 2019 |
| Latest publication | Jul 30, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Low warpage curing methodology by inducing curvature
US-11929260-B2 · Mar 12, 2024 · US
Methods and apparatus for cleaving of semiconductor substrates
US-11610807-B2 · Mar 21, 2023 · US
Low warpage curing methodology by inducing curvature
US-2023061379-A1 · Mar 2, 2023 · US
Methods and apparatus for cleaving of semiconductor substrates
US-11569122-B2 · Jan 31, 2023 · US
Methods and Apparatus for Cleaving of Semiconductor Substrates
US-2021233802-A1 · Jul 29, 2021 · US
Methods and apparatus for cleaving of semiconductor substrates
US-2021217656-A1 · Jul 15, 2021 · US
Methods and apparatus for cleaving of semiconductor substrates
US-10991617-B2 · Apr 27, 2021 · US
Methods and apparatus for microwave processing of polymer materials
US-2021001520-A1 · Jan 7, 2021 · US
Methods for forming microwave tunable composited thin-film dielectric layer
US-2020206775-A1 · Jul 2, 2020 · US
Recent patents
Latest publications not already listed above.
Methods and apparatus for cleaving of semiconductor substrates
US-2019355616-A1 · Nov 21, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 11 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0436 | 9 |
| H10P72/0602 | 8 |
| H01L21/67115 | 8 |
| H10P72/0604 | 6 |
| H10P72/0402 | 6 |