Die substrate assembly and method
US-9324674-B2 · Apr 26, 2016 · US
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De Bruin Emiel patents
De Bruin Emiel is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | De Bruin Emiel |
| Total patents | 6 |
| First publication | Mar 17, 2015 |
| Latest publication | Apr 26, 2016 |
Notable patents
Publications ranked by popularity score, then publication date.
Discrete semiconductor device package and manufacturing method
US-9263335-B2 · Feb 16, 2016 · US
Pre-soldered leadless package
US-9153529-B2 · Oct 6, 2015 · US
Die substrate assembly and method
US-2015179599-A1 · Jun 25, 2015 · US
Discrete semiconductor device package and manufacturing method
US-2015140739-A1 · May 21, 2015 · US
Discrete semiconductor device package and manufacturing method
US-8981566-B2 · Mar 17, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nxp Bv | 6 |
| Ampleon Netherlands Bv | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/952 | 6 |
| H10W72/9415 | 5 |
| H10W72/923 | 5 |
| H10W72/352 | 5 |
| H01L2924/014 | 5 |