Photosensitive material for photoresist and lithography
US-12578640-B2 · Mar 17, 2026 · US
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Cheng Yahru patents
Cheng Yahru is listed as an inventor on 77 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cheng Yahru |
| Total patents | 77 |
| First publication | Feb 7, 2019 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of developing photoresist
US-2026010077-A1 · Jan 8, 2026 · US
Method of reducing undesired light influence in extreme ultraviolet exposure
US-12517434-B2 · Jan 6, 2026 · US
Photoresist developer and method of developing photoresist
US-12487527-B2 · Dec 2, 2025 · US
Photoresist developer and method of developing photoresist
US-2025362598-A1 · Nov 27, 2025 · US
Gate Patterning for Stacked Device Structure
US-2025359292-A1 · Nov 20, 2025 · US
Semiconductor Device and Method of Fabricating Thereof
US-2025351547-A1 · Nov 13, 2025 · US
Semiconductor Device Having Dielectric Material Treated with Microwave Plasma and Method of Fabricating Thereof
US-2025349535-A1 · Nov 13, 2025 · US
Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern
US-12463034-B2 · Nov 4, 2025 · US
Photoresist layer outgassing prevention
US-2025323038-A1 · Oct 16, 2025 · US
Recent patents
Latest publications not already listed above.
Method of manufacturing semiconductor devices and pattern formation method
US-2025299955-A1 · Sep 25, 2025 · US
Method of manufacturing a semiconductor device
US-2025246430-A1 · Jul 31, 2025 · US
Photoresist layer outgassing prevention
US-12374548-B2 · Jul 29, 2025 · US
Method of manufacturing semiconductor devices and pattern formation method
US-12354874-B2 · Jul 8, 2025 · US
Semiconductor Device and Method of Fabricating Thereof
US-2025159966-A1 · May 15, 2025 · US
Method of manufacturing a semiconductor device and pattern formation method
US-2025147417-A1 · May 8, 2025 · US
Semiconductor Device Having Dielectric Material Treated with Microwave Plasma and Method of Fabricating Thereof
US-2025140553-A1 · May 1, 2025 · US
Method of manufacturing a semiconductor device
US-12272554-B2 · Apr 8, 2025 · US
Method of manufacturing a semiconductor device
US-12271113-B2 · Apr 8, 2025 · US
Method of manufacturing a semiconductor device and pattern formation method
US-12222643-B2 · Feb 11, 2025 · US
Method of manufacturing a semiconductor device and pattern formation method
US-12159787-B2 · Dec 3, 2024 · US
Method of manufacturing a semiconductor device
US-2024385514-A1 · Nov 21, 2024 · US
Method of manufacturing a semiconductor device and pattern formation method
US-2024387173-A1 · Nov 21, 2024 · US
Ambient controlled two-step thermal treatment for spin-on coating layer planarization
US-2024387188-A1 · Nov 21, 2024 · US
Method of manufacturing a semiconductor device
US-2024385523-A1 · Nov 21, 2024 · US
Method of manufacturing a semiconductor device
US-12135501-B2 · Nov 5, 2024 · US
Air spacer formation with a spin-on dielectric material
US-2024363722-A1 · Oct 31, 2024 · US
Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern
US-2024355623-A1 · Oct 24, 2024 · US
Humidity control or aqueous treatment for EUV metallic resist
US-12106961-B2 · Oct 1, 2024 · US
Gate Patterning for Stacked Device Structure
US-2024321640-A1 · Sep 26, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 83 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/168 | 39 |
| H10P76/2041 | 37 |
| G03F7/0042 | 35 |
| G03F7/38 | 35 |
| G03F7/167 | 31 |