Memory device and method for manufacturing memory device
US-12501609-B2 · Dec 16, 2025 · US
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Chen Longyang patents
Chen Longyang is listed as an inventor on 43 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Longyang |
| Total patents | 43 |
| First publication | Feb 17, 2022 |
| Latest publication | Dec 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor structure and manufacturing method thereof
US-12419036-B2 · Sep 16, 2025 · US
Semiconductor structure and method for manufacturing same
US-12408327-B2 · Sep 2, 2025 · US
Memory device, and semiconductor structure and forming method thereof
US-12369308-B2 · Jul 22, 2025 · US
Semiconductor structure and method for fabricating same
US-12347685-B2 · Jul 1, 2025 · US
Preparation method for semiconductor structure and same
US-12341010-B2 · Jun 24, 2025 · US
Semiconductor structure and method for manufacturing semiconductor structure
US-12284800-B2 · Apr 22, 2025 · US
Manufacturing method of semiconductor structure with epitaxial layer forming extension portion
US-12213305-B2 · Jan 28, 2025 · US
Semiconductor structure and manufacturing method thereof
US-12193209-B2 · Jan 7, 2025 · US
Memory device capacitor contact structure and method for preparing same
US-12185519-B2 · Dec 31, 2024 · US
Recent patents
Latest publications not already listed above.
Method for fabricating memory and memory
US-12160987-B2 · Dec 3, 2024 · US
Method for manufacturing semiconductor structure and same
US-12150294-B2 · Nov 19, 2024 · US
Semiconductor structure and method for preparing same
US-12114478-B2 · Oct 8, 2024 · US
Method for preparing semiconductor structure using a first mask comprises a groove
US-12108593-B2 · Oct 1, 2024 · US
Method for manufacturing a memory
US-12106817-B2 · Oct 1, 2024 · US
Method for manufacturing memory
US-12089398-B2 · Sep 10, 2024 · US
Semiconductor structure and manufacturing method thereof
US-11991874-B2 · May 21, 2024 · US
Method for forming a semiconductor memory structure
US-11956946-B2 · Apr 9, 2024 · US
DRAM semiconductor structure formation method and DRAM semiconductor structure
US-11956944-B2 · Apr 9, 2024 · US
Semiconductor structure and manufacturing method thereof
US-2023301066-A1 · Sep 21, 2023 · US
Preparation method for semiconductor structure and same
US-2023282479-A1 · Sep 7, 2023 · US
Method for preparing semiconductor structure, semiconductor structure, and semiconductor memory
US-2023180464-A1 · Jun 8, 2023 · US
Semiconductor structure and method for manufacturing same
US-2023180465-A1 · Jun 8, 2023 · US
Memory device and method for manufacturing memory device
US-2023180460-A1 · Jun 8, 2023 · US
Method for preparing semiconductor structure, semiconductor structure and semiconductor memory
US-2023164983-A1 · May 25, 2023 · US
Semiconductor structure and method for fabricating same
US-2023162981-A1 · May 25, 2023 · US
Semiconductor structure and method for manufacturing same
US-2023056204-A1 · Feb 23, 2023 · US
Semiconductor structure and method forming the same
US-2022392903-A1 · Dec 8, 2022 · US
Memory device, and semiconductor structure and forming method thereof
US-2022359526-A1 · Nov 10, 2022 · US
Manufacturing method of semiconductor structure and semiconductor structure
US-2022336466-A1 · Oct 20, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Changxin Memory Tech Inc | 43 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B12/482 | 30 |
| H10B12/315 | 27 |
| H10B12/0335 | 23 |
| H10B12/485 | 17 |
| H10B12/34 | 16 |