Semiconductor device with connecting structure having a doped layer and method for forming the same
US-12557623-B2 · Feb 17, 2026 · US
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Chen Kuo-Ju patents
Chen Kuo-Ju is listed as an inventor on 118 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Kuo-Ju |
| Total patents | 118 |
| First publication | Jul 2, 2015 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing semiconductor device
US-12538544-B2 · Jan 27, 2026 · US
Semiconductor devices with air gap and multiple implant steps for sealing the air gap
US-2025372447-A1 · Dec 4, 2025 · US
Semiconductor device and methods of forming the same
US-12484240-B2 · Nov 25, 2025 · US
Method for manufacturing semiconductor device
US-2025359295-A1 · Nov 20, 2025 · US
Semiconductor device and method
US-2025351510-A1 · Nov 13, 2025 · US
Semiconductor device and methods of forming the same
US-2025344424-A1 · Nov 6, 2025 · US
METHOD OF MANUFACTURING A FinFET BY IMPLANTING A DIELECTRIC WITH A DOPANT
US-2025324653-A1 · Oct 16, 2025 · US
Methods of forming semiconductor device
US-2025309103-A1 · Oct 2, 2025 · US
Device having an air gap adjacent to a contact plug and covered by a doped dielectric layer
US-12432963-B2 · Sep 30, 2025 · US
Recent patents
Latest publications not already listed above.
Method for manufacturing semiconductor device
US-12419099-B2 · Sep 16, 2025 · US
Methods of forming air spacers in semicondutor devices
US-2025248075-A1 · Jul 31, 2025 · US
Metal layer protection during wet etching
US-2025240991-A1 · Jul 24, 2025 · US
Methods of forming semiconductor device
US-12368098-B2 · Jul 22, 2025 · US
Semiconductor devices and methods of manufacture
US-2025210414-A1 · Jun 26, 2025 · US
Metal layer protection during wet etching
US-12300740-B2 · May 13, 2025 · US
Semiconductor device and manufacturing method thereof
US-2025126874-A1 · Apr 17, 2025 · US
Semiconductor devices and methods of manufacture
US-12278141-B2 · Apr 15, 2025 · US
Bottom lateral expansion of contact plugs through implantation
US-2025096041-A1 · Mar 20, 2025 · US
Methods of forming air spacers in semiconductor devices
US-12243940-B2 · Mar 4, 2025 · US
Semiconductor device and method
US-12224327-B2 · Feb 11, 2025 · US
Bottom lateral expansion of contact plugs through implantation
US-12183632-B2 · Dec 31, 2024 · US
Semiconductor device with connecting structure having a doped layer and method for forming the same
US-2024395606-A1 · Nov 28, 2024 · US
Semiconductor Device and Method
US-2024387661-A1 · Nov 21, 2024 · US
Reducing spacing between conductive features through implantation
US-2024363399-A1 · Oct 31, 2024 · US
Reducing spacing between conductive features through implantation
US-12112977-B2 · Oct 8, 2024 · US
Semiconductor device and method for forming the same
US-2024321751-A1 · Sep 26, 2024 · US
Metal loss prevention using implantation
US-12068195-B2 · Aug 20, 2024 · US
Methods of forming semiconductor device
US-2024274527-A1 · Aug 15, 2024 · US
Metal layer protection during wet etching
US-2024250147-A1 · Jul 25, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 119 |
| Univ Nat Chiao Tung | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D30/024 | 82 |
| H10D30/6219 | 77 |
| H10D30/62 | 76 |
| H10D84/038 | 67 |
| H10D30/797 | 62 |