Low-stress packaging structure for MEMS acceleration sensor chip
US-11780727-B2 · Oct 10, 2023 · US
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Che Lufeng patents
Che Lufeng is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Che Lufeng |
| Total patents | 5 |
| First publication | Oct 25, 2016 |
| Latest publication | Oct 10, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Low-stress packaging structure for mems acceleration sensor chip
US-2022306458-A1 · Sep 29, 2022 · US
Variable area capacitive lateral acceleration sensor and preparation method thereof
US-9625488-B2 · Apr 18, 2017 · US
Capacitive acceleration sensor with a bending elastic beam and preparation method thereof
US-9625487-B2 · Apr 18, 2017 · US
Capacitive acceleration sensor with an H-shaped beam and preparation method thereof
US-9476906-B2 · Oct 25, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Shanghai Inst Microsystem & Information Tech Cas | 3 |
| Univ Zhejiang | 2 |
| Shanghai Inst Of Microsystem And Information Tech Chinese Acad | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01P15/125 | 5 |
| G01P15/0802 | 4 |
| B81C1/00341 | 2 |
| G01P2015/0871 | 2 |
| G01P1/023 | 2 |