Thick film printed cooler for improved thermal management of direct bonded power devices
US-12598693-B2 · Apr 7, 2026 · US
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Catuneanu Andrei patents
Catuneanu Andrei is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Catuneanu Andrei |
| Total patents | 13 |
| First publication | Jun 2, 2022 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Alloy and methods for using alloy for transient liquid phase sintering
US-2026068107-A1 · Mar 5, 2026 · US
Systems for thermal management of an electronic device
US-12453046-B2 · Oct 21, 2025 · US
Brazed hybrid aluminum/copper heat exchangers
US-2025303503-A1 · Oct 2, 2025 · US
Systems for a heat exchanger with a biasing bracket and mounting plate
US-12317457-B2 · May 27, 2025 · US
Compact heat exchanger with wavy fin turbulizer
US-2025123062-A1 · Apr 17, 2025 · US
Brazed hybrid aluminum/copper heat exchangers
US-2025058392-A1 · Feb 20, 2025 · US
Compact heat exchanger with wavy fin turbulizer
US-12215933-B2 · Feb 4, 2025 · US
Systems for thermal management of an electronic device
US-2024237280-A9 · Jul 11, 2024 · US
Systems for thermal management of an electronic device
US-2024138107-A1 · Apr 25, 2024 · US
Recent patents
Latest publications not already listed above.
Thick film printed cooler for improved thermal management of direct bonded power devices
US-2024090119-A1 · Mar 14, 2024 · US
Systems for a heat exchanger
US-2023380103-A1 · Nov 23, 2023 · US
Compact heat exchanger with wavy fin turbulizer
US-2022170706-A1 · Jun 2, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Dana Canada Corp | 13 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K7/20872 | 6 |
| H05K7/20927 | 5 |
| H05K7/20254 | 5 |
| H05K7/20854 | 4 |
| H10W40/47 | 4 |