Systems for a heat exchanger with a biasing bracket and mounting plate

Patent metadata

Field	Value
Publication number	US-12317457-B2
Application number	US-202217663817-A
Country	US
Kind code	B2
Filing date	May 17, 2022
Priority date	May 17, 2022
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.

First claim

The invention claimed is:

1. A power electronics cooling assembly, comprising:
a first cooling plate;
a mounting plate, the mounting plate having mounting points to be attached to a housing;
an electronic module disposed between the first cooling plate and the mounting plate; and
a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate,
wherein the spring bracket comprises a plurality of flexible appendages in contact with the first cooling plate,
wherein the plurality of flexible appendages is arranged in multiple rows, and wherein the multiple rows are spaced apart from each other along a length of the spring bracket,
wherein each of the multiple rows comprises multiple flexible appendages of the plurality of flexible appendages, spaced apart along a width of the spring bracket, and
wherein each of the plurality of flexible appendages are in boxes recessed relative to a top surface of the spring bracket.

2. The power electronics cooling assembly of claim 1 , wherein the spring bracket is affixed over the first cooling plate and secured to the mounting plate via the mounting points aligned with the mounting points of the mounting plate, and wherein the plurality of flexible appendages extend in a direction towards the first cooling plate.

3. The power electronics cooling assembly of claim 1 , wherein the spring bracket comprises an I-shaped bar having a first end region and an opposing, second end region.

4. The power electronics cooling assembly of claim 3 , wherein the spring bracket comprises a plurality of cylindrical projections, the cylindrical projections being oriented perpendicular to the I-shaped bar and having a cylindrical cavity aligned with the mounting points of the mounting plate.

5. The power electronics cooling assembly of claim 1 , further comprising a second cooling plate, the second cooling plate positioned adjacent to an upper surface of the mounting plate and arranged in parallel with the first cooling plate, wherein the electronic module is compressed between the first cooling plate and the second cooling plate.

6. The power electronics cooling assembly of claim 5 , wherein the first cooling plate and the second cooling plate are fluidically coupled.

7. The power electronics cooling assembly of claim 1 , wherein the spring bracket comprises a central bar, wherein the central bar extends between cylindrical projections formed at opposing ends of the spring bracket, and wherein the central bar is planar.

8. The power electronics cooling assembly of claim 7 , wherein the plurality of flexible appendages are molded into the central bar in a grid-like arrangement.

9. The power electronics cooling assembly of claim 1 , wherein each of the plurality of flexible appendages further includes a compression finger at an underside of the plurality of flexible appendages.

10. The power electronics cooling assembly of claim 1 , wherein the box for each of the plurality of flexible appendages is open at the top surface of the spring bracket.

11. The power electronics cooling assembly of claim 1 , wherein the plurality of flexible appendages span across a majority of both a length of the spring bracket and a width of the spring bracket.

12. A system, comprising:
a power electronics cooling assembly including a first cooling plate, a mounting plate, an electronic module disposed between the first cooling plate and the mounting plate, the mounting plate comprising mounting points to be attached to a housing, and at least one or more of the following:
a spring bracket bending convexly towards the first cooling plate, the spring bracket comprising mounting points aligned with the mounting points of the mounting plate;
a stiff bar in contact with the first cooling plate, the stiff bar comprising mounting points aligned with the mounting points of the mounting plate, and the stiff bar being attached by springs to the mounting plate; and
a plastic spring bracket, the plastic spring bracket comprising mounting points aligned with the mounting points of the mounting plate, and the plastic spring bracket further comprising a plurality of flexible appendages in contact with the first cooling plate,

wherein the plurality of flexible appendages is arranged in multiple rows, and wherein the multiple rows are spaced apart from each other along a length of the plastic spring bracket,
wherein each of the multiple rows comprises multiple flexible appendages of the plurality of flexible appendages, spaced apart along a width of the plastic spring bracket, and
wherein the plurality of flexible appendages are arranged in a grid-like arrangement such that each of the plurality of flexible appendages are configured in separate boxes formed by longitudinal ridges.

13. The system of claim 12 , further comprising a second cooling plate, the second cooling plate positioned adjacent to an upper surface of the mounting plate and arranged in parallel with the first cooling plate, and wherein the electronic module is compressed between the first cooling plate and the second cooling plate.

14. The system of claim 12 , wherein the power electronics cooling assembly is substantially flat and I-shaped, and wherein the longitudinal ridges are molded into the plastic spring bracket.

15. A power electronics cooling assembly, comprising:
an upper cooling plate,
a lower cooling plate,
an electronic module disposed between the upper cooling plate and lower cooling plate, and
a mounting plate being in contact with the lower cooling plate, the mounting plate having mounting points to be attached to a housing, and at least one of the following:
a spring bracket bending convexly towards the upper cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate;
a bar in contact with the upper cooling plate, the bar having mounting points aligned with the mounting points of the mounting plate, and the bar being attached by springs to the mounting plate; and
a plastic spring bracket having a plurality of flexible appendages in contact with the upper cooling plate, the plastic spring bracket having mounting points aligned with the mounting points of the mounting plate,

wherein the plurality of flexible appendages is arranged in multiple rows, and wherein the multiple rows are spaced apart from each other along a length of the plastic spring bracket,
wherein each of the multiple rows comprises multiple flexible appendages of the plurality of flexible appendages, spaced apart along a width of the plastic spring bracket,
wherein each of the plurality of flexible appendages are recessed relative to a top surface of the plastic spring bracket, and
wherein the plurality of flexible appendages are arranged in a grid-like arrangement such that each of the plurality of flexible appendages are configured in separate boxes formed by longitudinal ridges.

16. The power electronics cooling assembly of claim 15 , wherein one of the spring bracket, the bar, and the plastic spring bracket is affixed over the upper cooling plate and secured to the mounting plate via the mounting points aligned with the mounting points of the mounting plate.

17. The power electronics cooling assembly of claim 15 , wherein the upper cooling plate and the lower cooling plate are fluidically coupled.

Assignees

• Dana Canada Corp

Inventors

• Catuneanu Andrei
• Kenney Benjamin A
• Tonellato Silvio
• Yu Jiangfeng

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/60 Primary

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H05K7/2049

  Pressing means used to urge contact, e.g. springs · CPC title