Systems for thermal management of an electronic device

Patent metadata

Field	Value
Publication number	US-12453046-B2
Application number	US-202218047860-A
Country	US
Kind code	B2
Filing date	Oct 19, 2022
Priority date	Oct 19, 2022
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

Systems are provided for a cooling system for an electric device. In one example, a system includes a metallic plate coupled to a circuit board and a coolant manifold. The coolant manifold comprises a semi-open coolant channel configured to flow coolant in contact with the metallic plate.

First claim

The invention claimed is:

1. A system, comprising:
a metallic plate;
a printed-circuit-board (PCB) including embedded integrated circuits, wherein the PCB is mounted on a first side of the metallic plate;
a dielectric isolation layer separating the PCB from the metallic plate and directly coupled to and in face-sharing contact with the PCB and the metallic plate, wherein the dielectric isolation layer is positioned to be between the embedded integrated circuits and the metallic plate; and
a semi-open coolant manifold directly mounted to a second side of the metallic plate, the second side opposite the first side.

2. The system of claim 1 , wherein the PCB is planar.

3. The system of claim 1 , wherein the embedded integrated circuits of the PCB include one or more of a switching circuit, a gate driver circuit, a filtering capacitor circuit, and an inductor circuit.

4. The system of claim 1 , wherein the coolant manifold comprises an interior volume configured to receive coolant from an inlet and flow the coolant to an outlet, and wherein the coolant in the interior volume contacts the metallic plate.

5. The system of claim 4 , wherein the interior volume comprises fins arranged therein, and wherein the fins comprise a sinusoidal shape.

6. The system of claim 5 , wherein gaps are arranged between adjacent fins, and wherein the gaps are free of fins to cause a discontinuity in a horizontal and a vertical direction between adjacent fins.

7. The system of claim 1 , wherein the PCB is laminated to the metallic plate and the coolant manifold is soldered to the metallic plate.

8. The system of claim 1 , wherein the dielectric layer is a single planar layer including an upper surface in face sharing contact with the PCB and a bottom surface in face sharing contact with the metallic plate, and wherein the metallic plate is a single metallic planar layer including an upper surface in face sharing contact with the bottom surface of the dielectric layer.

9. The system of claim 1 , wherein the metallic plate is a single metallic plate and the only metallic plate.

10. A power management system, comprising: a printed circuit board (PCB) laminated to a first side of a metallic plate and a coolant manifold hermetically sealed to a second side of the metallic plate, the second side opposite the first side, wherein the coolant manifold comprises a semi-open coolant passage configured to flow coolant in direct contact with the second side of the metallic plate, and wherein the coolant manifold is smaller than the metallic plate in a horizontal direction and a direction perpendicular to the horizontal direction and the metallic plate overhangs the coolant manifold around a circumference of the coolant manifold, wherein a dielectric isolation layer separating the PCB from the metallic plate and directly coupled to and in face-sharing contact with the PCB and the metallic plate.

11. The power management system of claim 10 , wherein the semi-open coolant passage is shaped via an outer rim, a side wall, and a back wall of the coolant manifold.

12. The power management system of claim 11 , wherein only the outer rim is in face-sharing contact with the second side of the metallic plate.

13. The power management system of claim 11 , wherein a plurality of surface features protrudes from the back wall toward the metallic plate.

14. The power management system of claim 10 , wherein the coolant manifold comprises an inlet adjacent to a first end and an outlet adjacent to a second end opposite the first end.

15. The power management system of claim 10 , wherein the metallic plate blocks the coolant flow directly to the PCB.

16. A cooling arrangement, comprising:
a printed circuit board (PCB) arranged in a common plane;
a dielectric isolation layer in face-sharing contact with the PCB;
a metallic plate comprising a first side in face-sharing contact with the dielectric isolation layer opposite the PCB to which the PCB and the dielectric isolation layer are laminated to from an integrated single piece, wherein a thickness of the metallic plate is less than 5 mm, and wherein the metallic plate is solid metal or an alloy; and
a coolant manifold comprising a semi-open coolant channel open to a second side of the metallic plate, wherein an outer rim of the coolant manifold is hermetically sealed to the second side.

17. The cooling arrangement of claim 16 , wherein the semi-open coolant channel comprises sinusoidal fins.

18. The cooling arrangement of claim 16 , further comprising the dielectric isolation layer arranged between the PCB and the metallic plate.

19. The cooling arrangement of claim 16 , wherein the cooling arrangement is arranged in an inverter of an electric vehicle.

20. The cooling arrangement of claim 16 , wherein the coolant manifold comprises an inlet at a first end of the coolant manifold and an outlet at a second end of the coolant manifold, the second end opposite the first end.

Assignees

• Dana Canada Corp

Inventors

• Liang Jingyuan
• Catuneanu Andrei
• Birkett Matthew S

Classifications

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K1/05

  Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title

• H05K7/20281

  Thermal management, e.g. liquid flow control · CPC title

• H05K7/20272 Primary

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title