Thick film printed cooler for improved thermal management of direct bonded power devices

Patent metadata

Field	Value
Publication number	US-12598693-B2
Application number	US-202318364335-A
Country	US
Kind code	B2
Filing date	Aug 2, 2023
Priority date	Sep 9, 2022
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

A cooler assembly, comprising: a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto, wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer; and at least one component coupled to the heat exchanger such that the at least one component is electrically isolated from the heat exchanger surface by the dielectric material, wherein the heat exchanger surface is electrically isolated with respect to the at least one component.

First claim

The invention claimed is:

1 . A cooler assembly, comprising:
a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto, wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer and the single or plurality of layers of the another material includes a printed thick film layer; and at least one component coupled to the heat exchanger such that the at least one component is electrically isolated from the heat exchanger surface by the dielectric material, wherein the heat exchanger surface is electrically isolated with respect to the at least one component.

2 . The cooler assembly of claim 1 , wherein the heat exchanger comprises a top plate and a core plate, wherein the top plate and core plate are brazed at a plurality of interfaces comprising surfaces of outer walls of the core plate.

3 . The cooler assembly of claim 2 , wherein the heat exchanger surface is a portion of the top plate of the heat exchanger.

4 . The cooler assembly of claim 1 , wherein the dielectric layer is a printed thick film layer.

5 . The cooler assembly of claim 1 , wherein a conductor layer comprising thermally and electrically conductive material compatible with metallurgic bonding is physically coupled to the exposed surface of the dielectric layer, such that the dielectric layer is sandwiched between the conductor layer and the heat exchanger surface.

6 . The cooler assembly of claim 5 , wherein the conductor layer is a printed thick film layer that is printed and fired on the exposed surface of the dielectric layer.

7 . The cooler assembly of claim 5 , wherein a bulk metal layer is physically and electrically coupled to the conductor layer via metallurgic bonding, such that the conductor layer is sandwiched between the bulk metal layer and the dielectric layer.

8 . The cooler assembly of claim 7 , wherein an electrical component or a plurality of electrical components are physically and electrically coupled to the bulk metal layer via metallurgic bonding, such that the bulk metal layer is sandwiched between the electrical component or electrical components and the conductor layer.

9 . The cooler assembly of claim 8 , wherein the heat exchanger surface has a plurality of dielectric layers comprising the dielectric layer, wherein the dielectric layers are patterned into a series of pads that are electrically isolated from one another.

10 . The cooler assembly of claim 8 , wherein the dielectric layer, the conductor layer, the bulk metal layer, and the electrical component or the electrical components are not physically coupled to a component comprised of metallized ceramic.

11 . The cooler assembly of claim 8 , wherein there are a plurality of conductor layers physically coupled to the dielectric layer.

12 . The cooler assembly of claim 8 , wherein the heat exchanger surface does not comprise a metallized ceramic and is not coupled to a component or feature comprising a metallized ceramic.

13 . A cooler assembly, comprising;
a heat exchanger having a heat exchanger surface that physically couples at least an electrical section comprised of:
a dielectric layer of dielectric material;
a conductor layer of thermally and electrically conducting material that is compatible with metallurgic bonding;
a bulk metal layer that is compatible with metallurgic bonding; and
an electrical component;
wherein, the dielectric layer is physically coupled to the heat exchanger surface, and wherein the conductor layer, the bulk metal layer, and the electrical component are coupled to an exposed surface of the dielectric layer such that the conductor layer is sandwiched between the bulk metal layer and the dielectric layer.

14 . The cooler assembly of claim 13 , wherein the dielectric layer is a printed thick film layer and the conductor layer is a printed thick film layer.

15 . The cooler assembly of claim 13 , wherein the heat exchanger does not include a thermal interface material and a metallized ceramic sandwiched between the dielectric layer and the heat exchanger surface, coupled to the exposed surface of dielectric layer, or coupled to a component or feature coupled to the exposed surface of the dielectric layer.

16 . The cooler assembly of claim 13 , with a plurality of electrical sections, wherein each electrical section is formed into a plurality of first pads comprising the dielectric layer and at least a second pad, wherein the second pad comprises a conductor layer physically coupled to an exposed surface of one of the first pads, a bulk metal layer physically and electrically coupled to the conductor layer, and an electrical component physically and electrically coupled to the bulk metal layer.

17 . The cooler assembly of claim 16 , wherein there are a plurality of second pads directly coupled to at least one of the first pads, wherein the second pads are comprised of materials of the second pad.

18 . The cooler assembly of claim 13 , where the bulk metal layer or a plurality of bulk metal layers are physically and electrically coupled to the conductor layer via a metallurgic bond, and the electrical component is physically and electrically coupled to each bulk metal layer via a metallurgic bond.

19 . A method of assembling an electrical section to a cooler assembly, comprising:
applying a dielectric layer via paste printing to a heat exchanger surface; firing and/or curing the dielectric layer; applying a conductor layer via paste printing on an exposed surface of the dielectric layer; firing and/or curing the conductor layer; physically and electrically coupling a bulk metal layer to the conductor layer via metallurgic bonding; and physically and electrically coupling an electronic component to the bulk metal layer via metallurgic bonding.

20 . A cooler assembly, comprising:
a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto, wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer; and at least one component coupled to the heat exchanger such that the at least one component is electrically isolated from the heat exchanger surface by the dielectric material, wherein the heat exchanger surface is electrically isolated with respect to the at least one component, wherein a conductor layer comprising thermally and electrically conductive material compatible with metallurgic bonding is physically coupled to the exposed surface of the dielectric layer, such that the dielectric layer is sandwiched between the conductor layer and the heat exchanger surface, wherein a bulk metal layer is physically and electrically coupled to the conductor layer via metallurgic bonding, such that the conductor layer is sandwiched between the bulk metal layer and the dielectric layer, wherein an electrical component or a plurality of electrical components are physically and electrically coupled to the bulk metal layer via metallurgic bonding, such that the bulk metal layer is sandwiched between the electrical component or electrical components and the conductor layer, and wherein the heat exchanger surface has a plurality of dielectric layers comprising the dielectric layer, wherein the dielectric layers are patterned into a series of pads that are electrically isolated from one another.

Assignees

• Dana Canada Corp

Inventors

• Birkett Matthew S
• Catuneanu Andrei

Classifications

• H05K3/1291

  Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W70/098

  Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence) · CPC title

• H05K1/0207 Primary

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title