Clustered microvia structure for a high-density interface PCB
US-12588146-B2 · Mar 24, 2026 · US
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Bodi Gregory Patrick patents
Bodi Gregory Patrick is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bodi Gregory Patrick |
| Total patents | 10 |
| First publication | Apr 29, 2021 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Electroplating edge connector pins of printed circuit boards without using tie bars
US-2026082490-A1 · Mar 19, 2026 · US
Electroplating edge connector pins of printed circuit boards without using tie bars
US-12484156-B2 · Nov 25, 2025 · US
Buried skip vias for improved signal and power integrity
US-2024389230-A1 · Nov 21, 2024 · US
Clustered microvia structure for a high-density interface pcb
US-2024074053-A1 · Feb 29, 2024 · US
Electroplating edge connector pins of printed circuit boards without using tie bars
US-2023276578-A1 · Aug 31, 2023 · US
Electroplating edge connector pins of printed circuit boards without using tie bars
US-11653455-B2 · May 16, 2023 · US
Inter-layer slot for increasing printed circuit board power performance
US-11439002-B2 · Sep 6, 2022 · US
Electroplating edge connector pins of printed circuit boards without using tie bars
US-2022279659-A1 · Sep 1, 2022 · US
Inter-layer slot for increasing printed circuit board power performance
US-2021127479-A1 · Apr 29, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nvidia Corp | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/117 | 5 |
| H05K3/0047 | 5 |
| H05K2201/0347 | 5 |
| H05K3/043 | 5 |
| H05K2203/175 | 5 |