Integrated circuit chip including back side power delivery tracks
US-12557634-B2 · Feb 17, 2026 · US
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Beyne Eric patents
Beyne Eric is listed as an inventor on 69 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Beyne Eric |
| Total patents | 69 |
| First publication | Feb 5, 2015 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Methods of producing a receiving substrate for bonding semiconductor dies thereto
US-2025349763-A1 · Nov 13, 2025 · US
Methods of producing a receiving substrate for bonding semiconductor dies thereto
US-2025349557-A1 · Nov 13, 2025 · US
Semiconductor Component Including One or More Conductors Comprising a Stack of Ferromagnetic and Nonmagnetic Materials
US-2025266376-A1 · Aug 21, 2025 · US
Method of producing an integrated circuit chip including a back-side power delivery network
US-12362236-B2 · Jul 15, 2025 · US
Device and system for cooling an electronic component
US-12342503-B2 · Jun 24, 2025 · US
Semiconductor product and method for manufacturing a semiconductor product
US-2025125291-A1 · Apr 17, 2025 · US
Method for Thinning a Semiconductor Substrate
US-2025118564-A1 · Apr 10, 2025 · US
Semiconductor Component Comprising Structured Contacts and A Method for Producing the Component
US-2025118691-A1 · Apr 10, 2025 · US
Method for producing solder bumps on a superconducting qubit substrate
US-2024297136-A1 · Sep 5, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor component with metal-insulator-metal capacitor assembly
US-2024222260-A1 · Jul 4, 2024 · US
Micro-electronic component combining power delivery and cooling from the back side
US-2024213120-A1 · Jun 27, 2024 · US
Method for bonding and interconnecting micro-electronic components
US-2024203965-A1 · Jun 20, 2024 · US
Device and system for cooling an electronic component
US-2024121914-A1 · Apr 11, 2024 · US
Method of direct bonding semiconductor components
US-11810892-B2 · Nov 7, 2023 · US
Substrate, assembly and method for wafer-to-wafer hybrid bonding
US-11769750-B2 · Sep 26, 2023 · US
Quantum Bit Chip and Method for Fabricating Quantum Bit Chip
US-2023200263-A1 · Jun 22, 2023 · US
Semiconductor component including back side input/output signal routing
US-2023170297-A1 · Jun 1, 2023 · US
Method of producing an integrated circuit chip including a back-side power delivery network
US-2023142597-A1 · May 11, 2023 · US
Integrated circuit chip including back side power delivery tracks
US-2023080522-A1 · Mar 16, 2023 · US
Method for dicing a semiconductor substrate into a plurality of dies
US-11476162-B2 · Oct 18, 2022 · US
Method for packaging semiconductor dies
US-11462420-B2 · Oct 4, 2022 · US
Method for packaging semiconductor dies
US-11367705-B2 · Jun 21, 2022 · US
Method and system to produce dies for a wafer reconstitution
US-2022189830-A1 · Jun 16, 2022 · US
Method for the electrical bonding of semiconductor components
US-11362061-B2 · Jun 14, 2022 · US
Method for fabricating an optical device
US-11316066-B2 · Apr 26, 2022 · US
Substrate, assembly and method for wafer-to-wafer hybrid bonding
US-2022037283-A1 · Feb 3, 2022 · US
Method for bonding semiconductor components
US-2021159207-A1 · May 27, 2021 · US
Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC
US-10985057-B2 · Apr 20, 2021 · US
Method for Dicing a Semiconductor Substrate into a Plurality of Dies
US-2021098299-A1 · Apr 1, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Imec Vzw | 59 |
| Univ Leuven Kath | 11 |
| Imec | 10 |
| Micledi Microdisplays Bv | 2 |
| Beyne Eric | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 30 |
| H10W72/252 | 20 |
| H10W72/072 | 20 |
| H10W72/952 | 19 |
| H10W90/724 | 19 |