Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-11967548-B2 · Apr 23, 2024 · US
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Bernstein Kerry patents
Bernstein Kerry is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bernstein Kerry |
| Total patents | 22 |
| First publication | Mar 5, 2015 |
| Latest publication | Apr 23, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-2020144169-A1 · May 7, 2020 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-10622294-B2 · Apr 14, 2020 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-10586760-B2 · Mar 10, 2020 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-2018090428-A1 · Mar 29, 2018 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-2018090427-A1 · Mar 29, 2018 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-9905505-B2 · Feb 27, 2018 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-9905506-B2 · Feb 27, 2018 · US
System and method of masking electromagnetic interference (EMI) emissions of a circuit
US-9496981-B2 · Nov 15, 2016 · US
Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit
US-9301424-B2 · Mar 29, 2016 · US
Recent patents
Latest publications not already listed above.
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-2016049360-A1 · Feb 18, 2016 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-2016049353-A1 · Feb 18, 2016 · US
Reactive metal optical security device and methods of fabrication and use
US-9264150-B2 · Feb 16, 2016 · US
Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit
US-9257366-B2 · Feb 9, 2016 · US
Auto-Compensating Temperature Valve Controller for Electro-Rheological Fluid Micro-Channel Cooled Integrated Circuit
US-2016037682-A1 · Feb 4, 2016 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-9252072-B2 · Feb 2, 2016 · US
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US-9252071-B2 · Feb 2, 2016 · US
Methods for normalizing strain in semicondcutor devices and strain normalized semiconductor devices
US-9082875-B2 · Jul 14, 2015 · US
Detecting chip alterations with light emission
US-9075106-B2 · Jul 7, 2015 · US
Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof
US-9052724-B2 · Jun 9, 2015 · US
Auto-Compensating Temperature Valve Controller for Electro-Rheological Fluid Micro-Channel Cooled Integrated Circuit
US-2015116939-A1 · Apr 30, 2015 · US
Beol compatible fet structure
US-2015060856-A1 · Mar 5, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 20 |
| Bernstein Kerry | 4 |
| Goodnow Kenneth J | 2 |
| Ogilvie Clarence R | 2 |
| Ventrone Sebastian T | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/47 | 17 |
| H10W40/00 | 16 |
| H01L23/473 | 15 |
| H10W90/297 | 12 |
| H10W90/288 | 12 |