Differential contrast plating for advanced packaging applications
US-12559853-B2 · Feb 24, 2026 · US
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Banik Ii Stephen J patents
Banik Ii Stephen J is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Banik Ii Stephen J |
| Total patents | 23 |
| First publication | Aug 24, 2017 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Low temperature direct copper-copper bonding
US-12424453-B2 · Sep 23, 2025 · US
Cross flow conduit for foaming prevention in high convection plating cells
US-2025051953-A1 · Feb 13, 2025 · US
Cross flow conduit for foaming prevention in high convection plating cells
US-12157949-B2 · Dec 3, 2024 · US
Temporary capping material for oxide prevention in low temperature direct metal-metal bonding
US-2024312778-A1 · Sep 19, 2024 · US
Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate
US-2024141541-A1 · May 2, 2024 · US
Spatially and dimensionally non-uniform channelled plate for tailored hydrodynamics during electroplating
US-2024076795-A1 · Mar 7, 2024 · US
Electro-oxidative metal removal accompanied by particle contamination mitigation in semiconductor processing
US-2023230847-A1 · Jul 20, 2023 · US
Surface pretreatment for electroplating nanotwinned copper
US-2023212773-A1 · Jul 6, 2023 · US
Cross flow conduit for foaming prevention in high convection plating cells
US-2023175162-A1 · Jun 8, 2023 · US
Recent patents
Latest publications not already listed above.
Cross flow conduit for foaming prevention in high convection plating cells
US-11585007-B2 · Feb 21, 2023 · US
Low temperature direct copper-copper bonding
US-2022018036-A1 · Jan 20, 2022 · US
Electrodeposition of nanotwinned copper structures
US-2022010446-A1 · Jan 13, 2022 · US
Cross flow conduit for foaming prevention in high convection plating cells
US-2021395913-A1 · Dec 23, 2021 · US
Methods and apparatus for flow isolation and focusing during electroplating
US-11001934-B2 · May 11, 2021 · US
Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US-10781527-B2 · Sep 22, 2020 · US
Method and apparatus for synchronized pressure regulation of separated anode chamber
US-10760178-B2 · Sep 1, 2020 · US
Systems and methods for achieving uniformity across a redistribution layer
US-10714436-B2 · Jul 14, 2020 · US
Method and apparatus for synchronized pressure regulation of separated anode chamber
US-2020017989-A1 · Jan 16, 2020 · US
Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US-2019085479-A1 · Mar 21, 2019 · US
Methods and apparatus for flow isolation and focusing during electroplating
US-2019055665-A1 · Feb 21, 2019 · US
Systems and methods for fabrication of a redistribution layer to avoid etching of the layer
US-10211052-B1 · Feb 19, 2019 · US
Systems and methods for achieving uniformity across a redistribution layer
US-2017243839-A1 · Aug 24, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 23 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 20 |
| C25D21/12 | 15 |
| C25D7/123 | 15 |
| C25D5/08 | 13 |
| H10P14/47 | 13 |