Cross flow conduit for foaming prevention in high convection plating cells

Patent metadata

Field	Value
Publication number	US-2023175162-A1
Application number	US-202318155238-A
Country	US
Kind code	A1
Filing date	Jan 17, 2023
Priority date	Nov 19, 2018
Publication date	Jun 8, 2023
Grant date	—

Abstract

The embodiments herein relate to apparatuses and methods for electroplating one or more materials onto a substrate. Embodiments herein utilize a cross flow conduit in the electroplating cell to divert flow of fluid from a region between a substrate and a channeled ionically resistive plate positioned near the substrate down to a level lower than level of fluid in a fluid containment unit for collecting overflow fluid from the plating system for recirculation. The cross flow conduit can include channels cut into components of the plating cell to allow diverted flow, or can include an attachable diversion device mountable to an existing plating cell to divert flow downwards to the fluid containment unit. Embodiments also include a flow restrictor which may be a plate or a pressure relief valve for modulating flow of fluid in the cross flow conduit during plating.

First claim

What is claimed is:

1 . An electroplating apparatus comprising:
an electroplating cell configured to contain an electrolyte and an anode while electroplating metal onto a substrate; a fluid containment unit having an inlet and configured to receive the electrolyte via the inlet, wherein the inlet comprises an opening in a body of the fluid containment unit, located lower than a fluid level in the fluid containment unit during electroplating; a substrate holder configured to hold the substrate such that a plating face of the substrate is separated from the anode during electroplating; a channeled ionically resistive plate including a substrate-facing surface that is separated from the plating face of the substrate by a cross flow region; a cross flow inlet to the cross flow region for providing electrolyte to the cross flow region; and a cross flow conduit comprising a channel for diverting electrolyte from the cross flow region to the inlet feeding the fluid containment unit of the electroplating cell, the cross flow region being between the cross flow inlet and cross flow conduit.

2 . The electroplating apparatus of claim 1 , wherein the cross flow channel comprises an opening in the channeled ionically resistive plate for downward flow of the electrolyte from the cross flow region.

3 . The electroplating apparatus of claim 1 , wherein the cross flow channel comprises an opening in the channeled ionically resistive plate and an opening in a membrane frame aligned with the opening in the channeled ionically resistive plate for downward flow of the electrolyte from the cross flow region.

4 . The electroplating apparatus of claim 1 , wherein the cross flow channel comprises an opening in the channeled ionically resistive plate, an opening in a membrane frame aligned with the opening in the channeled ionically resistive plate and an opening in an electroplating cell aligned for downward flow of the electrolyte from the cross flow region.

5 . The electroplating apparatus of claim 1 , wherein the cross flow region is defined at least in part by an upper surface of the channeled ionically resistive plate and a lower surface of the substrate in the substrate holder when in operation, and an insert.

6 . The electroplating apparatus of claim 1 , wherein the cross flow conduit is disposed to accept electrolyte flowing out of the cross flow region and direct the electrolyte flowing out downward and away from a surface of the substrate.

7 . The electroplating apparatus of claim 1 , further comprising a flow restrictor for restricting flow of electrolyte in the cross flow conduit.

8 . The electroplating apparatus of claim 7 , wherein the flow restrictor is one of:
a plate inserted under the channeled ionically resistive plate, a motor-driven variable aperture plate capable of varying opening size of the cross flow conduit, or a pressure relief valve sealing flow of electrolyte depending on pressure of the electrolyte in response to whether a substrate is present in the electroplating cell.

9 . The electroplating apparatus of claim 8 , further comprising a controller comprising executable instructions for electroplating material onto the substrate by:
causing flow of electrolyte via cross flow across a surface of the substrate from one side of the substrate to the opposite side of the substrate; causing diversion of flow of electrolyte to below fluid level as electrolyte flows to the opposite side of the substrate for collection in the fluid containment unit; and causing widening and narrowing of an opening of the cross flow conduit using the motor-driven variable aperture plate in response to flow rate of electrolyte.

10 . The electroplating apparatus of claim 1 , wherein the cross flow conduit is an attachable diversion device capable of being attached to the electroplating cell.

11 . The electroplating apparatus of claim 1 , further comprising a weir wall.

12 . The electroplating apparatus of claim 1 , wherein the cross flow channel is made by stacked openings in one or more components of the electroplating apparatus, allowing for downward movement of the electrolyte.

13 . The electroplating apparatus of claim 1 , wherein the cross flow channel comprises a C-shaped opening in at least some components of the electroplating apparatus.

14 . The electroplating apparatus of claim 1 , wherein the cross flow channel comprises an opening in at least some components of the electroplating apparatus for downward movement of the electrolyte, wherein the opening is located at an azimuthally opposite perimeter location to the cross flow inlet.

15 . The electroplating apparatus of claim 1 , further comprising an annular insert positioned above the channeled ionically resistive plate and the cross flow conduit.

Assignees

• Lam Res Corp

Inventors

• Banik Ii Stephen J
• Berke Aaron
• Graham Gabriel Hay
• Kearns Gregory J
• Chua Lee Peng
• Buckalew Bryan L

Classifications

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D17/02 Primary

  Tanks; Installations therefor · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/008

  Current shielding devices · CPC title

• C25D5/08 Primary

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title