Method for optimizing low-band-low-band carrier-aggregation transmit and receive performance
US-12431919-B2 · Sep 30, 2025 · US
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Baldwin John C patents
Baldwin John C is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Baldwin John C |
| Total patents | 24 |
| First publication | Dec 15, 2015 |
| Latest publication | Sep 30, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US-2025202529-A1 · Jun 19, 2025 · US
Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US-12191932-B2 · Jan 7, 2025 · US
Nested filters
US-2024090123-A1 · Mar 14, 2024 · US
Devices and methods related to nested filters
US-11765814-B2 · Sep 19, 2023 · US
Method for optimizing low-band-low-band carrier-aggregation transmit and receive performance
US-2023188165-A1 · Jun 15, 2023 · US
Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US-2023131326-A1 · Apr 27, 2023 · US
Radio frequency device with integrated antenna tuner and multiplexer
US-11588512-B2 · Feb 21, 2023 · US
Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US-11546019-B2 · Jan 3, 2023 · US
Radio frequency device with integrated antenna tuner and multiplexer
US-2022045710-A1 · Feb 10, 2022 · US
Recent patents
Latest publications not already listed above.
Radio frequency device with integrated antenna tuner and multiplexer
US-11245432-B2 · Feb 8, 2022 · US
Radio frequency device with integrated antenna tuner and multiplexer
US-2020287583-A1 · Sep 10, 2020 · US
Reconfigurable front-end module for carrier aggregation
US-10727893-B2 · Jul 28, 2020 · US
Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US-2020186202-A1 · Jun 11, 2020 · US
Stacked wafer-level packaging devices
US-2020091890-A1 · Mar 19, 2020 · US
Devices and methods related to nested filters
US-2020077510-A1 · Mar 5, 2020 · US
Stacked wafer-level packaging devices
US-10396753-B2 · Aug 27, 2019 · US
Reconfigurable front-end module for carrier aggregation
US-2019028136-A1 · Jan 24, 2019 · US
Circuits and methods related to radio-frequency power couplers
US-9954562-B2 · Apr 24, 2018 · US
Stacked wafer-level packaging devices
US-2017324395-A1 · Nov 9, 2017 · US
Devices and methods related to stacked duplexers
US-9660609-B2 · May 23, 2017 · US
Devices and methods related to stacked duplexers
US-2017012603-A1 · Jan 12, 2017 · US
Circuits and methods related to radio-frequency power couplers
US-2016099731-A1 · Apr 7, 2016 · US
Circuits and methods for reducing insertion loss effects associated with radio-frequency power couplers
US-9214967-B2 · Dec 15, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Skyworks Solutions Inc | 24 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W42/20 | 10 |
| H05K1/0243 | 8 |
| H04B1/04 | 8 |
| H04B1/006 | 7 |
| H04B1/40 | 7 |