Devices and methods related to stacked duplexers

Patent metadata

Field	Value
Publication number	US-9660609-B2
Application number	US-201615204391-A
Country	US
Kind code	B2
Filing date	Jul 7, 2016
Priority date	Jul 7, 2015
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

Devices and method related to stacked duplexers. In some embodiments, an assembly may include a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield. The assembly may also include a second WLP device having an RF shield, the second WLP device positioned over the first WLP device such that the RF shield of the second WLP device is electrically connected to the RF shield of the first WLP device.

First claim

What is claimed is:

1. An assembly comprising:
a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield; and
a second WLP device having an RF shield, the second WLP device positioned over the first WLP device such that the RF shield of the second WLP device is electrically connected to the RF shield of the first WLP device.

2. The assembly of claim 1 wherein the first WLP device includes a first RF filter, and the second WLP device includes a second RF filter.

3. The assembly of claim 2 wherein each of the first and second RF filters includes a grounding contact pad, at least one input contact pad, and at least one output contact pad.

4. The assembly of claim 3 wherein the RF shield of each of the first and second RF filters includes a conformal coating of conductive material.

5. The assembly of claim 4 wherein the conformal coating of each RF filter is electrically connected to the corresponding grounding contact pad.

6. The assembly of claim 5 wherein the second RF filter is in an inverted orientation such that the conformal coating of the RF second filter is in electrical contact with the conformal coating of the first RF filter.

7. The assembly of claim 6 wherein the conformal coating of the second RF filter is electrically connectable to an external ground node through the grounding contact pad of the first RF filter.

8. The assembly of claim 5 wherein the first RF filter has a first lateral dimension and the second RF filter has a second lateral dimension that is greater than the first lateral dimension such that each of a plurality of edges of the second RF filter forms an overhang over a corresponding edge of the first RF filter.

9. The assembly of claim 8 wherein the second RF filter is in an upright orientation, and some or all of the grounding contact pad, the at least one input contact pad, and the at least one output contact pad are located at the overhanging edges.

10. The assembly of claim 9 further comprising a plurality of mounting structures configured to allow mounting of the second RF filter to a packaging substrate at locations that are laterally offset beyond the corresponding edges of the first RF filter.

11. The assembly of claim 10 wherein at least some of the mounting structures is configured to provide one or more electrical connections between the second RF filter and the packaging substrate.

12. The assembly of claim 11 wherein the one or more electrical connections between the second RF filter and the packaging substrate includes a grounding connection between the grounding contact pad of the second RF filter and a ground on the packaging substrate.

13. The assembly of claim 12 wherein the mounting structures include a printed circuit board (PCB) implemented on each of two opposing sides of the first RF filter, the PCB having a thickness selected to allow the second RF filter to be positioned over the first RF filter.

14. The assembly of claim 12 wherein the mounting structures include a ball-grid array (BGA) implemented on each of two opposing sides of the first RF filter, the BGA dimensioned to allow the second RF filter to be positioned over the first RF filter.

15. The assembly of claim 12 wherein the mounting structures include a ball-grid array (BGA) and a printed circuit board (PCB) implemented on each of two opposing sides of the first RF filter, the BGA and the PCB dimensioned to allow the second RF filter to be positioned over the first RF filter.

16. The assembly of claim 12 wherein the mounting structures include an interposer structure implemented on each of two opposing sides of the first RF filter, the interposer structure dimensioned to allow the second RF filter to be positioned over the first RF filter.

17. The assembly of claim 2 wherein the first RF filter is configured to provide receive (RX) filtering functionality for one or more RX frequency bands.

18. The assembly of claim 17 wherein the second RF filter is configured to provide transmit (TX) filtering functionality for one or more TX frequency bands.

19. The assembly of claim 18 wherein the first and second RF filters are configured to provide duplexer functionality for the corresponding one or more frequency bands.

20. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components; and
a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second WLP device having an RF shield, the second WLP device positioned over the first WLP device such that the RF shield of the second WLP device is electrically connected to the RF shield of the first WLP device.

Assignees

• Skyworks Solutions Inc

Inventors

• Reisner Russ Alan
• Baldwin John C

Classifications

• H10W90/28

  the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/0198

  batch processes · CPC title