Devices and methods related to nested filters

Patent metadata

Field	Value
Publication number	US-11765814-B2
Application number	US-201916558056-A
Country	US
Kind code	B2
Filing date	Aug 31, 2019
Priority date	Aug 31, 2018
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

First claim

What is claimed is:

1. A wireless device comprising:
a transmitter circuit, and a receiver circuit;
one or more antennas configured to support transmit and receive operations; and
a radio-frequency module operationally coupled to the transmitter circuit, the receiver circuit and the one or more antennas, the radio-frequency module including a substrate having a plurality of layers with a first layer at an upper side of the substrate and a second layer underneath the first layer, the first layer including an upper surface, the second layer including an upper surface such that a cavity is defined by the first layer and a rectangular shaped floor provided by the upper surface of the second layer, the radio-frequency module further including a stopper layer implemented on the upper surface of the second layer to form a boundary around the cavity, and a first set of contact pads implemented on the upper surface of the first layer so as to be within a first rectangular region that overlaps with the rectangular floor of the cavity, the first set of contact pads including two input pins and two antenna pins each connected to an antenna of the one or more antennas when the antenna is in operation, the two input pins and two antenna pins positioned at respective corners of the first rectangular region, the radio-frequency module further including a second set of contact pads implemented on the rectangular shaped floor of the cavity, the second set of contact pads including two antenna pins and two output pins, each antenna pin connected to an antenna of the one or more antennas when the antenna is in operation, the two antenna pins and two output pins arranged so that the two antenna pins are positioned at respective corners of the rectangular shaped floor such that the two antenna pins of the second set of contact pads are adjacent to the two antenna pins of the first set of contact pads, the radio-frequency module further including first and second sets of support structures implemented over the first and second sets of contact pads, respectively, the radio-frequency module further including transmit and receive filter devices positioned over the first and second sets of support structures, respectively, such that the receive filter device is mounted on the substrate so as to be in a space defined by an underside of the transmit filter device and the first set of support structures, each of the first set of support structures dimensioned to provide sufficient height in the space to accommodate the receive filter device, and including a solder structure and a metal structure formed from a copper core or copper pillar, the metal structure configured to prevent collapse of the transmit filter device onto the receive filter device if the solder structure fails, the transmit filter device including two output pins each connected to the respective one of the two input pins of the first set of contact pads, the receive filter device including two input pins each connected to the respective one of the two output pins of the second set of contact pads.

2. The wireless device of claim 1 wherein each of the transmit filter device and the receive filter device is implemented as a surface acoustic wave device.

3. The wireless device of claim 1 wherein the transmit filter device is configured to support a plurality of respective frequency bands, and the receive filter device is configured to support a plurality of respective frequency bands.

4. The wireless device of claim 3 wherein the frequency bands associated with the transmit filter device are the same as the frequency bands associated with the receive filter device.

5. The wireless device of claim 1 wherein the radio-frequency module further includes a mold structure implemented over the substrate to substantially encapsulate the transmit and receive filter devices.

Assignees

• Skyworks Solutions Inc

Inventors

• Darveaux Robert Francis
• Lee Ki Wook
• Furusawa Takeshi
• Nangalia Sundeep Nand
• Reisner Russ Alan
• Baldwin John C

Classifications

• H04B1/40 Primary

  Circuits · CPC title

• H05K1/0243 Primary

  Printed circuits associated with mounted high frequency components · CPC title

• H04B1/18

  Input circuits, e.g. for coupling to an antenna or a transmission line (coupling networks between antennas or lines and receivers independent of the nature of the receiver H03H) · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H05K1/181

  associated with surface mounted components · CPC title