Apparatus for minimizing electromagnetic coupling between surface mount device inductors

US11546019B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11546019-B2
Application numberUS-201916707776-A
CountryUS
Kind codeB2
Filing dateDec 9, 2019
Priority dateDec 10, 2018
Publication dateJan 3, 2023
Grant dateJan 3, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.

First claim

Opening claim text (preview).

What is claimed is: 1. A surface mount device inductor mountable on a printed circuit board, comprising: an inductor coil configured to generate a magnetic field along an axis when a current is applied to the inductor coil; a dielectric material disposed about the inductor coil; an anode structure disposed over and at least partially enclosing a first end of the inductor coil; a cathode structure disposed over and at least partially enclosing a second end of the inductor coil opposite the first end, the cathode structure being spaced apart from the anode structure; and a shield portion disposed at least partially over the inductor coil and extending along a plane that extends generally transverse to the axis to thereby reduce electromagnetic coupling between adjacent surface mount device inductors, the shield portion defined by one or both of a top wall of the anode structure and a top wall of the cathode structure that is spaced apart from the top wall of the anode structure. 2. The surface mount device inductor of claim 1 wherein the shield portion is an ungrounded metal portion attached to a surface of the dielectric material. 3. The surface mount device inductor of claim 2 wherein the ungrounded metal portion is attached to only one surface of the dielectric material. 4. The surface mount device inductor of claim 1 wherein the shield portion is defined by the top wall of one of the anode structure and the cathode structure that has a greater length than the top wall of the other of the anode structure and the cathode structure. 5. The surface mount device inductor of claim 1 wherein the shield portion is defined by the top wall of the anode and cathode structures that extend over a majority of the inductor coil, at least a portion of a left-side wall and a right-side wall of the anode and cathode structures that extend in a lengthwise direction of the inductor extending from the top wall to a location spaced above the substrate. 6. The surface mount device inductor of claim 1 wherein the axis extends transverse to a plane that defines a left-side wall of one or both of the anode structure and the cathode structure. 7. The surface mount device inductor of claim 1 wherein the axis extends transverse to a plane that defines a top wall of one or both of the anode structure and the cathode structure. 8. A radiofrequency module, comprising: a printed circuit board including a substrate layer; one or more surface mount device inductors mounted on the substrate layer, each surface mount device inductor including: an inductor coil configured to generate a magnetic field along an axis when a current is applied to the inductor coil; a dielectric material disposed about the inductor coil; an anode structure disposed over and at least partially enclosing a first end of the inductor coil; a cathode structure disposed over and at least partially enclosing a second end of the inductor coil opposite the first end, the cathode structure being spaced apart from the anode structure; and a shield portion disposed at least partially over the inductor coil and extending along a plane extending generally transverse to the axis to thereby reduce electromagnetic coupling between adjacent surface mount device inductors, the shield portion defined by one or both of a top wall of the anode structure and a top wall of the cathode structure that is spaced apart from the top wall of the anode structure. 9. The radiofrequency module of claim 8 wherein the shield portion is an ungrounded metal portion attached to a surface of the dielectric material. 10. The radiofrequency module of claim 9 wherein the ungrounded metal portion is attached to only one surface of the dielectric material. 11. The radiofrequency module of claim 8 wherein the shield portion is defined by the top wall of one of the anode structure and the cathode structure that has a greater length than the top wall of the other of the anode structure and the cathode structure. 12. The radiofrequency module of claim 8 wherein the shield portion is defined by the top wall of the anode and cathode structures that extend over a majority of the inductor coil, at least a portion of a left-side wall and a right-side wall of the anode and cathode structures that extend in a lengthwise direction of the inductor extending from the top wall to a location spaced above the substrate. 13. The radiofrequency module of claim 8 wherein the axis extends transverse to a plane that defines a left-side wall of one or both of the anode structure and the cathode structure. 14. The radiofrequency module of claim 8 wherein the axis extends transverse to a plane that defines a top wall of one or both of the anode structure and the cathode structure. 15. A wireless mobile device comprising: one or more antennas; a front end system that communicates with the one or more antennas, the front end system including one or more surface mount device inductors mounted on a substrate layer, each surface mount device inductor including: an inductor coil configured to generate a magnetic field along an axis when a current is applied to the inductor coil; a dielectric material disposed about the inductor coil; an anode structure disposed over and at least partially enclosing a first end of the inductor coil; a cathode structure disposed over and at least partially enclosing a second end of the inductor coil opposite the first end, the cathode structure being spaced apart from the anode structure; and a shield portion disposed at least partially over the inductor coil and extending along a plane extending generally transverse to the axis to thereby reduce electromagnetic coupling between adjacent surface mount device inductors, the shield portion defined by one or both of a top wall of the anode structure and a top wall of the cathode structure that is spaced apart from the top wall of the anode structure. 16. The wireless mobile device of claim 15 wherein the shield portion is an ungrounded metal portion attached to a surface of the dielectric material. 17. The wireless mobile device of claim 16 wherein the ungrounded metal portion is attached to only one surface of the dielectric material. 18. The wireless mobile device of claim 15 wherein the shield portion is defined by the top wall of one of the anode structure and the cathode structure that has a greater length than the top wall of the other of the anode structure and the cathode structure. 19. The wireless mobile device of claim 15 wherein the shield portion is defined by the top wall of the anode and cathode structures that extend over a majority of the inductor coil, at least a portion of a left-side wall and a right-side wall of the anode and cathode structures that extend in a lengthwise direction of the inductor extending from the top wall to a location spaced above the substrate. 20. The wireless mobile device of claim 15 wherein the axis extends transverse to a plane that defines a left-side wall of one or both of the anode structure and the cathode structure. 21. The wireless mobile device of claim 15 wherein the axis extends transverse to a plane that defines a top wall of one or both of the anode structure and the cathode structure.

Assignees

Inventors

Classifications

  • Printed circuits associated with mounted high frequency components · CPC title

  • Electric or magnetic shields or screens (movable for varying inductance H01F21/10) · CPC title

  • Non-printed inductor · CPC title

  • with stacked layers · CPC title

  • Insulating of coils, windings, or parts thereof · CPC title

Patent family

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Frequently asked questions

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What does patent US11546019B2 cover?
A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.
Who is the assignee on this patent?
Skyworks Solutions Inc
What technology area does this patent fall under?
Primary CPC classification H04B5/0081. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 03 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).