Space-efficient underfilling techniques for electronic assemblies

Patent metadata

Field	Value
Publication number	US-9728425-B1
Application number	US-201615089491-A
Country	US
Kind code	B1
Filing date	Apr 2, 2016
Priority date	Apr 2, 2016
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

Space-efficient underfilling techniques for electronic assemblies are described. According to some such techniques, an underfilling method may comprise mounting an electronic element on a surface of a substrate, dispensing an underfill material upon the surface of the substrate within a dispense region for forming an underfill for the electronic element, and projecting curing rays upon at least a portion of the dispensed underfill material to inhibit an outward flow of dispensed underfill material from the dispense region, and the underfill material may comprise a non-visible light (NVL)-curable material. Other embodiments are described and claimed.

First claim

What is claimed is:

1. A method, comprising:
mounting an electronic element on a surface of a substrate;
dispensing an underfill material upon the surface of the substrate within a dispense region for forming an underfill for the electronic element, the underfill material to comprise a non-visible light (NVL)-curable material; and
projecting curing rays upon a portion of the dispensed underfill material to inhibit an outward flow of dispensed underfill material from the dispense region into a keep-out-zone while allowing the dispensed underfill material to flow within the dispense region.

2. The method of claim 1 , the curing rays to comprise ultraviolet (UV) light.

3. The method of claim 1 , the curing rays to comprise infrared (IR) light.

4. The method of claim 1 , comprising conveying a dispense assembly along a dispense path to dispense the underfill material within the dispense region.

5. The method of claim 4 , the dispense assembly to comprise a light source, the light source to project a curing beam upon at least a portion of the dispensed underfill material as the dispense assembly traverses the dispense path.

6. The method of claim 1 , comprising projecting a curing frame upon a curing region surrounding the dispense region, the curing region to correspond to the keep-out-zone.

7. The method of claim 1 , the electronic element to comprise a semiconductor die.

8. The method of claim 7 , the semiconductor die to comprise one or more integrated circuits (ICs).

9. The method of claim 1 , the substrate to comprise a printed circuit board (PCB).

10. The method of claim 1 , the underfill material to comprise an NVL-curable epoxy.

11. A method, comprising:
projecting curing rays onto a substrate to form a curing frame to define a dispense region within the curing frame and keep-out-zone; and
dispensing an underfill material onto the substrate in the dispense region to form an underfill for an electronic element, the underfill material to comprise a non-visible light (NVL)-curable material, the curing rays to inhibit an outward flow of dispensed underfill material from the dispense region into the keep-out-zone while allowing the dispensed underfill material to flow within the dispense region.

12. The method of claim 11 , the curing rays to comprise ultraviolet (UV) light.

13. The method of claim 11 , the curing rays to comprise infrared (IR) light.

14. The method of claim 11 , the electronic element to comprise a semiconductor die.

15. The method of claim 14 , the semiconductor die to comprise one or more integrated circuits (ICs).

16. The method of claim 11 , the substrate to comprise a printed circuit board (PCB).

17. The method of claim 11 , the underfill material to comprise an NVL-curable epoxy.

Assignees

• Intel Corp

Inventors

• Heppner Joshua D
• Roux Serge
• Baker Michael J
• Falcon Javier A

Classifications

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title

• B29K2063/00

  Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material · CPC title

• B29K2995/0005

  Conductive · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title