Apparatus, system, and method for implanting surgical material

US11937879B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11937879-B2
Application numberUS-202217749086-A
CountryUS
Kind codeB2
Filing dateMay 19, 2022
Priority dateApr 18, 2022
Publication dateMar 26, 2024
Grant dateMar 26, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for implanting surgical material in a patient's body is disclosed. The system comprises a two-dimensional (2D) laser cutter network comprising a 2D laser cutter and a processor. The processor is configured to perform the steps of capturing an image of an open area of a patient's body and processing a drug implant substrate to create a customized drug implant substrate. The customized drug implant may be created based on the captured image to correspond with the open area of the patient's body. The drug implant substrate is shaped using the 2D laser cutter. The processor is further configured to perform the steps of placing the customized drug implant substrate in the open area of the patient's body and sealing the open area after placing the customized drug implant substrate in the open area.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for implanting surgical material in a patient's body, the system comprising: a laser cutter network comprising: a laser cutter; and a processor configured with instructions that, when executed by the processor, cause the processor to perform the steps of: capturing, with an imaging device, an image of an open area of the patient's body and an XY scale adjacent the open area of the patient's body; creating, based at least in part on the captured image, a two-dimensional profile associated with the open area of the patient's body; modifying the two-dimensional profile by adding one or more tabs at discrete locations along the two-dimensional profile, the one or more tabs expanding the two-dimensional profile at the discrete locations; creating, with the laser cutter and based at least in part on the captured image, a customized implant substrate corresponding to the two-dimensional profile and the one or more tabs; placing the customized implant substrate in the open area of the patient's body; and sealing the open area, after placing the customized implant substrate in the open area. 2. The system as in claim 1 , wherein creating the implant substrate comprises shaping the implant substrate using the laser cutter. 3. The system as in claim 1 , wherein the instructions further cause the processor to determine an accuracy score for the customized implant substrate. 4. The system as in claim 3 , further comprising determining that the accuracy score is above a threshold score. 5. The system as in claim 1 , further comprising a communication link to a laser cutter network and wherein the system is configured to retrieve, via the network, a cut profile. 6. The system as in claim 5 , wherein the instructions further cause the processor to actuate the laser cutter to shape the implant substrate according to the cut profile. 7. The system as in claim 1 , wherein creating the implant substrate comprises cutting the implant substrate to include the one or more tabs. 8. The system as in claim 7 , wherein the instructions further cause the processor to actuate the laser cutter to remove the one or more tabs from the implant substrate. 9. The system as in claim 1 , wherein the instructions further cause the processor to scale the image based at least in part on an XY scale displayed in the image. 10. The system as in claim 1 , further comprising an additive manufacturing system and wherein creating the customized implant substrate comprises actuating the additive manufacturing system. 11. A surgical method, under control of one or more processors, comprising: opening and cleaning an implant area within a patient; capturing, with an imaging device, an image of the implant area and the XY scale; creating, based at least in part on the image of the implant area, a profile for an implant substrate; modifying the profile for the implant substrate by adding one or more tabs at discrete locations along the profile, the tabs expanding the profile at the discrete locations; cutting, based at least in part on the profile and with a laser cutter, the implant substrate to include the one or more tabs at the discrete locations along the profile; positioning the implant substrate into the implant area within the patient; and closing the implant area within the patient. 12. The surgical method as in claim 11 , wherein the implant substrate is one or more of a drug implant substrate, prosthetic substrate, structural biologics substrate, or an antibiotic substrate. 13. The surgical method as in claim 11 , further comprising the step of loading the implant substrate into the laser cutter prior to cutting the implant substrate. 14. The surgical method as in claim 11 , wherein the step of cutting the implant substrate includes cutting around the one or more tabs. 15. The surgical method as in claim 11 , further comprising the step of adding a solution to the implant substrate to create biocompatibility between the implant substrate and the patient. 16. The surgical method as in claim 11 , further comprising the step of establishing a communications link between the one or more processors and a laser cutter network and retrieving, from the laser cutter network a cut profile. 17. The surgical method as in claim 11 , further comprising the step of scaling the captured image to create a scaled image and cutting, with the laser cutter, the implant substrate based at least in part on the scaled image. 18. The surgical method as in claim 11 , further comprising the step of capturing, with the imaging device, a second image that displays the implant substrate and the implant area. 19. The surgical method as in claim 18 , further comprising the step of determining an accuracy score between the implant substrate and the implant area and displaying the accuracy score on a user interface.

Assignees

Inventors

Classifications

  • A61B34/10Primary

    Computer-aided planning, simulation or modelling of surgical operations · CPC title

  • A61B90/361Primary

    Image-producing devices, e.g. surgical cameras · CPC title

  • Other apparatus for introducing media into the body (for reproduction or fertilisation A61B17/425; apparatus for iontophoresis or cataphoresis A61N1/30); Percutany, i.e. introducing medicines into the body by diffusion through the skin (salt baths A61H33/04) · CPC title

  • relating to mechanical, radiation or invasive therapies, e.g. surgery, laser therapy, dialysis or acupuncture · CPC title

  • Computer aided selection or customisation of medical implants or cutting guides · CPC title

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What does patent US11937879B2 cover?
A system for implanting surgical material in a patient's body is disclosed. The system comprises a two-dimensional (2D) laser cutter network comprising a 2D laser cutter and a processor. The processor is configured to perform the steps of capturing an image of an open area of a patient's body and processing a drug implant substrate to create a customized drug implant substrate. The customized d…
Who is the assignee on this patent?
Ix Innovation Llc
What technology area does this patent fall under?
Primary CPC classification A61B34/10. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Mar 26 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).