Identification codes on semiconductor chips
US-12379666-B2 · Aug 5, 2025 · US
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Assmann Heiko patents
Assmann Heiko is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Assmann Heiko |
| Total patents | 8 |
| First publication | Oct 12, 2017 |
| Latest publication | Aug 5, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Identification codes on semiconductor chips
US-2023350309-A1 · Nov 2, 2023 · US
Semiconductor device power metallization layer with stress-relieving heat sink structure
US-11276624-B2 · Mar 15, 2022 · US
Semiconductor Device Power Metallization Layer with Stress-Relieving Heat Sink Structure
US-2021183732-A1 · Jun 17, 2021 · US
Method for producing a self-aligning masking layer
US-10468248-B2 · Nov 5, 2019 · US
Exposure mask, exposure apparatus and method for calibrating an exposure apparatus
US-10331036-B2 · Jun 25, 2019 · US
Exposure mask, exposure apparatus and method for calibrating an exposure apparatus
US-2017336718-A1 · Nov 23, 2017 · US
Method for producing a self-aligning masking layer
US-2017294299-A1 · Oct 12, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 6 |
| Infineon Technologies Austria Ag | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P95/90 | 2 |
| H10P76/20 | 2 |
| H10P34/42 | 2 |
| H10P30/204 | 2 |
| H10P30/22 | 2 |