Chip tracking with marking database
US-10108925-B1 · Oct 23, 2018 · US
Identification codes on semiconductor chips
US12379666B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12379666-B2 |
| Application number | US-202318137131-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 20, 2023 |
| Priority date | Apr 29, 2022 |
| Publication date | Aug 5, 2025 |
| Grant date | Aug 5, 2025 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method of generating chip-specific identification code marks on semiconductor chips includes patterning a resist layer over a semiconductor wafer by laser direct image exposure, the patterning including writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer. The patterned resist layer is then developed.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of generating chip-specific identification code marks on semiconductor chips, the method comprising: patterning a resist layer over a semiconductor wafer by laser direct image exposure, wherein the patterning includes writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer and defining a chip pad layout in the resist layer over the chip areas, wherein the resist layer is an uppermost resist layer and remains permanently on the semiconductor wafer; and developing the patterned resist layer, wherein the chip-specific identification code marks are formed and the chip pads are exposed in the developed resist layer. 2. The method of claim 1 , wherein the resist layer is of a negative tone resist. 3. The method of claim 1 , wherein the resist layer is of a positive tone resist. 4. The method of claim 1 , wherein the patterning has a minimum patterning width of equal to or greater than 1 μm. 5. The method of claim 1 , wherein a laser beam energy applied for the laser direct image exposure is insufficient for laser ablation in semiconductor technology. 6. The method of claim 1 , wherein the chip-specific identification code marks are optically visible on the chip. 7. The method of claim 1 , wherein the chip areas are power chip areas or MEMS chip areas. 8. The method of claim 1 , wherein the chip areas are CMOS logic chip areas. 9. The method of claim 1 , wherein the chip-specific identification codes comprise a cryptographic key for authenticating the semiconductor chips.
Assignees
Inventors
Classifications
characterised by the processes involved to create the masks · CPC title
using lasers · CPC title
using masks for insulating materials · CPC title
Formed on wafers or substrates before dicing and remaining on chips after dicing · CPC title
digital information, e.g. bar codes · CPC title
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Frequently asked questions
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- What does patent US12379666B2 cover?
- A method of generating chip-specific identification code marks on semiconductor chips includes patterning a resist layer over a semiconductor wafer by laser direct image exposure, the patterning including writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer. The patterned resist layer is then developed.
- Who is the assignee on this patent?
- Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification G03F7/70541. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Aug 05 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).