Ultrasonic bonding method, ultrasonic bonding apparatus, and ultrasonic bonding system
US-12583186-B2 · Mar 24, 2026 · US
Aizawa Takahiro is listed as an inventor on 41 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Aizawa Takahiro |
| Total patents | 41 |
| First publication | Mar 24, 2015 |
| Latest publication | Mar 24, 2026 |
Publications ranked by popularity score, then publication date.
US-12583186-B2 · Mar 24, 2026 · US
US-2026081312-A1 · Mar 19, 2026 · US
US-12573351-B2 · Mar 10, 2026 · US
US-2026031062-A1 · Jan 29, 2026 · US
US-12505818-B2 · Dec 23, 2025 · US
US-2025332504-A1 · Oct 30, 2025 · US
US-12450022-B2 · Oct 21, 2025 · US
US-2025300122-A1 · Sep 25, 2025 · US
US-2025300123-A1 · Sep 25, 2025 · US
US-2025293407-A1 · Sep 18, 2025 · US
Latest publications not already listed above.
US-2025162062-A1 · May 22, 2025 · US
US-2025166589-A1 · May 22, 2025 · US
US-2025158240-A1 · May 15, 2025 · US
US-2025118273-A1 · Apr 10, 2025 · US
US-2025104597-A1 · Mar 27, 2025 · US
US-2025103263-A1 · Mar 27, 2025 · US
US-12230841-B2 · Feb 18, 2025 · US
US-2024326345-A1 · Oct 3, 2024 · US
US-2023216155-A1 · Jul 6, 2023 · US
US-2022271399-A1 · Aug 25, 2022 · US
US-11370180-B2 · Jun 28, 2022 · US
US-2022105692-A1 · Apr 7, 2022 · US
US-2022105693-A1 · Apr 7, 2022 · US
US-11292211-B1 · Apr 5, 2022 · US
US-2021280840-A1 · Sep 9, 2021 · US
US-2021280841-A1 · Sep 9, 2021 · US
US-2021280837-A1 · Sep 9, 2021 · US
US-10684673-B2 · Jun 16, 2020 · US
US-2018264513-A1 · Sep 20, 2018 · US
US-2018107265-A1 · Apr 19, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Toshiba Kk | 23 |
| Sony Interactive Entertainment Inc | 9 |
| Sony Corp | 9 |
| Sony Mobile Communications Inc | 4 |
| Kioxia Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B23K20/10 | 13 |
| Y02E60/10 | 11 |
| G09G2340/0435 | 9 |
| H01M50/536 | 9 |
| H01M50/533 | 9 |