Ultrasonic bonding apparatus, control device and control method

Patent metadata

Field	Value
Publication number	US-11370180-B2
Application number	US-202117351746-A
Country	US
Kind code	B2
Filing date	Jun 18, 2021
Priority date	Oct 7, 2020
Publication date	Jun 28, 2022
Grant date	Jun 28, 2022

Abstract

An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.

First claim

What is claimed is:

1. An ultrasonic bonding apparatus comprising:
a stage where a bonding target member can be arranged on an upper side in a height direction, the height direction being perpendicular or approximately perpendicular to a bonded surface of the bonding target member;
a bonding tool arranged above the bonding target member in the height direction, and configured to bond the bonding target member by being driven in a state of using pressurizing force to press the bonding target member downward in the height direction and transmitting ultrasonic vibration, which vibrates in a direction along the bonded surface, to the bonding target member;
a sensor configured to detect vibration along the height direction in the bonding target member when the ultrasonic vibration vibrating in the direction along the bonded surface is transmitted to the bonding target member; and
a control device configured to change a control parameter associated with driving of the bonding tool based on information related to the vibration along the height direction detected by the sensor.

2. The ultrasonic bonding apparatus according to claim 1 , wherein
the control device is configured to acquire, as the information related to the vibration along the height direction, amplitude of the vibration along the height direction,
the control device is configured to use, as the control parameter, a target value for the pressurizing force, a target value for amplitude of the ultrasonic vibration, and a target value for a time for oscillating the ultrasonic vibration, and
the control device is configured to change at least one of the control parameters when the amplitude of the vibration along the height direction is greater than a first specified value.

3. The ultrasonic bonding apparatus according to claim 2 , wherein the control device is configured to ceases the driving of the bonding tool when the amplitude is greater than a second specified value.

4. A control device used together with a bonding tool configured to bond a bonding target member by being driven in a state of using pressurizing force to press the bonding target member downward in a height direction and transmitting ultrasonic vibration, which vibrates in a direction along a bonded surface of the bonding target member, to the bonding target member, the height direction being perpendicular or approximately perpendicular to the bonded surface, the control device comprising
a processor configured to change a control parameter associated with the driving of the bonding tool based on information related to vibration along the height direction in the bonding target member, the vibration along the height direction being detected when the ultrasonic vibration vibrating in the direction along the bonded surface is transmitted to the bonding target member.

5. A control method comprising:
bonding a bonding target member by driving a bonding tool in a state of using pressurizing force to press the bonding target member downward in a height direction and transmitting ultrasonic vibration, which vibrates in a direction along a bonded surface of the bonding target member, to the bonding target member, the height direction being perpendicular or approximately perpendicular to the bonded surface;
detecting vibration along the height direction in the bonding target member when the ultrasonic vibration vibrating in the direction along the bonded surface is transmitted to the bonding target member; and
changing a control parameter associated with the driving of the bonding tool based on information related to the detected vibration along the height direction of the bonding target member.

Assignees

• Toshiba Kk

Inventors

• Aizawa Takahiro
• Ito Takashi
• Tanabe Masatoshi
• Yamamoto Haruka

Classifications

• B23K20/106 Primary

  Features related to sonotrodes · CPC title

• B06B1/0246

  with a feedback signal · CPC title

• B29C65/08

  using ultrasonic vibrations {(non-plastics element to plastics elements B29C65/645)} · CPC title

• B06B1/02

  making use of electrical energy (B06B1/18, B06B1/20 take precedence) · CPC title

• B29C66/9511

  by measuring their vibration frequency · CPC title