Ultrasonic bonding method, ultrasonic bonding apparatus, and ultrasonic bonding system

Patent metadata

Field	Value
Publication number	US-12583186-B2
Application number	US-202418437184-A
Country	US
Kind code	B2
Filing date	Feb 8, 2024
Priority date	Mar 27, 2023
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

According to one embodiment, an ultrasonic bonding method for bonding a plurality of bonding members together by applying pressure and an ultrasonic wave includes a pressing step of applying pressure to one bonding member and another bonding member so as to press against each other, an application step of applying an ultrasonic wave to the one bonding member, a detection step of detecting a vibration state of another bonding member during the application step, and a step of determining a state of bonding between the bonding members based on the vibration state acquired in the detection step.

First claim

What is claimed is:

1 . An ultrasonic bonding process comprising:
pressurizing a first bonding member against a second bonding member in a first direction for a period of time; while pressurizing the first bonding member against the second bonding member in the first direction during the period of time, applying ultrasonic waves to the second bonding member to cause vibration in the first bonding member in a second direction perpendicular to the first direction; determining a state of the vibration of the first bonding member in the second direction during the applying of the ultrasonic waves to the second bonding member; and determining a bonding state of the first bonding member and the second bonding member based on the determined state of the vibration.

2 . The ultrasonic bonding process according to claim 1 , further comprising:
pressurizing the first bonding member against the second bonding member for an additional period of time; and while pressurizing the first bonding member against the second bonding member during the additional period of time, applying ultrasonic waves to the second bonding member based on the bonding state.

3 . The ultrasonic bonding process according to claim 1 , wherein
the bonding state is determined to be not defective if a peak is observed in the amplitude of the vibration in the second direction.

4 . The ultrasonic bonding process according to claim 1 , further comprising:
while pressurizing the first bonding member against the second bonding member, and applying the ultrasonic waves to cause the vibration in the first bonding member during the period of time, applying an external force to the first bonding member and the second bonding member; and determining a position of possible fracture based on the amplitude of the vibration.

5 . The ultrasonic bonding process according to claim 4 , wherein
the position of the possible fracture is determined to be inside or at an interface between the first bonding member and the second bonding member if the amplitude of the vibration has two peaks in the second direction.

6 . An ultrasonic bonding apparatus comprising:
a mechanical press configured to press a first bonding member against a second bonding member in a first direction; an ultrasonic wave generator configured to apply ultrasonic waves to the second bonding member in a second direction perpendicular to the first direction; a sensor configured to detect a state of vibration of the first bonding member in the second direction; and a processor configured to determine a bonding state between the first bonding member and the second bonding member based on the detected state of the vibration.

7 . The ultrasonic bonding apparatus according to claim 6 , further comprising:
a control device configured to control the mechanical press and the ultrasonic wave generator based on control signals from the processor.

8 . The ultrasonic bonding apparatus according to claim 7 , wherein
the ultrasonic wave generator includes an ultrasonic horn transmitting the ultrasonic waves to the second bonding member, and the processor determines that the bonding state is not defective if a peak is observed in the amplitude of the vibration in the first bonding member in the second direction.

9 . The ultrasonic bonding apparatus according to claim 7 , wherein
the processor is configured to cause the control device to stop the mechanical press or the ultrasonic wave generator after the amplitude of the vibration in the second direction reaches a peak amplitude and then decreases.

10 . The ultrasonic bonding apparatus according to claim 7 , wherein
the sensor is an optical sensor, a laser sensor, or an eddy current displacement sensor.

11 . An ultrasonic bonding system comprising:
a mechanical press configured to press a first bonding member against a second bonding member in a first direction; an ultrasonic wave generator configured to apply ultrasonic waves to the second bonding member in a second direction perpendicular to the first direction; a sensor configured to detect a state of vibration of the first bonding member in the second direction; and a control device configured to control the mechanical press and the ultrasonic wave generator to carry out a process including: pressurizing the first bonding member against the second bonding member in the first direction; while pressurizing the first bonding member against the second bonding member in the first direction for a period of time, applying ultrasonic waves to the second bonding member to cause vibration in the first bonding member in a second direction perpendicular to the first direction; and determining a bonding state of the first bonding member and the second bonding member based on the state of the vibration detected by the sensor during the applying of the ultrasonic waves to the second bonding member.

12 . The ultrasonic bonding system according to claim 11 , wherein the process further includes:
pressurizing the first bonding member against the second bonding member for an additional period of time; and while pressurizing the first bonding member against the second bonding member during the additional period of time, applying ultrasonic waves to the second bonding member based on the bonding state.

13 . The ultrasonic bonding system according to claim 11 , wherein
the bonding state is determined to be not defective if a peak is observed in the amplitude of the vibration in the second direction.

14 . The ultrasonic bonding system according to claim 11 , wherein the process further includes:
while pressurizing the first bonding member against the second bonding member, and applying the ultrasonic waves to cause the vibration in the first bonding member during the period of time, applying an external force to the first bonding member and the second bonding member; and determining a position of possible fracture based on the amplitude of the vibration.

15 . The ultrasonic bonding system according to claim 14 , wherein
the position of the possible fracture is determined to be inside or at an interface between the first bonding member and the second bonding member if the amplitude of the vibration has two peaks in the second direction.

Assignees

• Toshiba Kk

Inventors

• Shinohara Yuto
• Aizawa Takahiro
• Ito Takashi

Classifications

• B29C66/9515

  by measuring their vibration amplitude · CPC title

• H01M50/54

  Connection of several leads or tabs of plate-like electrode stacks, e.g. electrode pole straps or bridges · CPC title

• B23K20/26

  Auxiliary equipment · CPC title

• B23K31/125

  Weld quality monitoring · CPC title

• H01M50/536

  characterised by the method of fixing the leads to the electrodes, e.g. by welding · CPC title