Ultrasonic bonding apparatus

Patent metadata

Field	Value
Publication number	US-2022105692-A1
Application number	US-202117351774-A
Country	US
Kind code	A1
Filing date	Jun 18, 2021
Priority date	Oct 6, 2020
Publication date	Apr 7, 2022
Grant date	—

Abstract

An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.

First claim

1 . An ultrasonic bonding apparatus comprising:
a stage where a plurality of bonding target members are arranged on an upperside in a height direction, each of the bonding target members including a main surface and an edge portion, the bonding target members overlapping each other in the height direction, the bonding target members being arranged in a state that the main surface of each of the bonding target members faces the height direction and the edge portion of each of the bonding target members faces a direction intersecting the height direction, a bonding tool arranged above the bonding target members in the height direction, and configured to bond the bonding target members by being driven in a state of using pressurizing force to press the bonding target members downward in the height direction and transmitting ultrasonic vibration, which vibrates in the direction intersecting the height direction, to the bonding target members; a temperature sensor configured to detect a temperature in the edge portions of the bonding target members when the ultrasonic vibration is transmitted to the bonding target members; and a control device configured to change a control parameter associated with driving of the bonding tool based on information related to the temperature in the edge portions of the bonding target members detected by the temperature sensor.

2 . (canceled)

3 . The ultrasonic bonding apparatus according to claim 1 , wherein
the bonding target members include a first bonding target member, and a second bonding target member arranged adjacent to the first bonding target member in the height direction and forming a bonding surface with the first bonding target member, and a measurement range of the temperature by the temperature sensor includes an area in which, among the edge portion of the first bonding target member and the edge portion of the second bonding target member, a distance between the edge portions and the bonding tool is the shortest.

4 . The ultrasonic bonding apparatus according to claim 1 , wherein the temperature sensor is a contact temperature sensor or a noncontact temperature sensor.

5 . The ultrasonic bonding apparatus according to claim 1 , wherein
information related to the temperature includes a surface temperature in the edge portions of the bonding target members, the control parameter includes at least one selected from a target value of the pressurizing force, a target value of amplitude of the ultrasonic vibration, a target value of a time for oscillating the ultrasonic vibration, and a target value of a position of the bonding tool in the height direction, and the control device changes at least one of the control parameters when the surface temperature falls outside a reference range of the temperature.

Assignees

• Toshiba Kk

Inventors

• Ito Takashi
• Aizawa Takahiro
• Tanabe Masatoshi
• Yamamoto Haruka

Classifications

• B23K20/10 Primary

  making use of vibrations, e.g. ultrasonic welding · CPC title

• B06B1/0246

  with a feedback signal · CPC title

• B06B2201/72

  Welding, joining, soldering · CPC title

• H01R43/0207

  Ultrasonic-, H.F.-, cold- or impact welding · CPC title

• B29C65/08

  using ultrasonic vibrations {(non-plastics element to plastics elements B29C65/645)} · CPC title