Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers
US-2025149432-A1 · May 8, 2025 · US
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Patent family 80118818
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 80118818 |
| Family type | — |
| Earliest priority | Jan 27, 2021 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US2025149432A1 — Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers |
Representative publication
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US2025149432A1 — Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers (published May 8, 2025)
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