Helical plated through-hole package inductor
US-11608564-B2 · Mar 21, 2023 · US
This page is not indexed by search engines while we improve data quality.
Patent family 59057872
This patent family groups 5 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 59057872 |
| Family type | — |
| Earliest priority | Dec 17, 2015 |
| First filing country | US |
| Member publications | 5 |
| Countries | US |
| Representative publication | US11608564B2 — Helical plated through-hole package inductor |
Representative publication
Best representative member for this family based on priority and filing country.
US11608564B2 — Helical plated through-hole package inductor (published Mar 21, 2023)
Member publications
Related publications in this family.
Helical plated through-hole package inductor
US-2021304952-A1 · Sep 30, 2021 · US
Method of making an inductor
US-10998120-B2 · May 4, 2021 · US
Helical plated through-hole package inductor
US-2019051447-A1 · Feb 14, 2019 · US
Helical plated through-hole package inductor
US-10163557-B2 · Dec 25, 2018 · US