Helical plated through-hole package inductor

Patent metadata

Field	Value
Publication number	US-2019051447-A1
Application number	US-201816162465-A
Country	US
Kind code	A1
Filing date	Oct 17, 2018
Priority date	Dec 17, 2015
Publication date	Feb 14, 2019
Grant date	—

Abstract

Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.

First claim

The claimed invention is:

1 . A method of making an inductor comprising:
forming an aperture in a dielectric, the aperture extending from and through a first surface and a second surface of the dielectric, the first surface opposite the second surface, the aperture including an aperture wall; depositing conductive material on the first surface, the second surface, and the aperture wall; and removing a portion of the conductive material through the entire thickness to form one or more coils on the aperture wall, wherein the coil encircles the aperture in at least one revolution and extends from the first surface to the second surface.

2 . The method of claim 1 , wherein removing a portion of the conductive material on the aperture wall includes removing the portion of the conductive material with a coil cutting bit.

3 . The method of claim 2 , wherein removing the portion of the conductive material on the aperture wall with the coil cutting bit includes:
rotating and translating the coil cutting bit in a sequence along a path from the first surface to the second surface thereby removing the conductive layer on the aperture wall; and rotating and translating the coil cutting bit in a reverse sequence along the path to withdrawal the coil cutting bit from the aperture.

4 . The method of claim 3 , wherein the sequence includes a helical path.

5 . The method of claim 1 , further comprising situating a magnetic core within the aperture.

6 . The method of claim 5 , wherein situating the magnetic core within the aperture includes depositing, within the aperture, magnetic particles suspended in a carrier.

7 . The method of claim 6 , wherein the magnetic particles include at least one of iron, manganese-zinc ferrite, molybdenum, nickel-zinc, sendust, and silicon steel.

8 . The method of claim 5 , wherein the magnetic core is disposed in physical contact with the aperture wall between segments of the coil.

9 . The method of claim 5 , wherein the magnetic core is disposed in physical contact with separate segments of the coil.

10 . The method of claim 1 , wherein providing the dielectric layer includes providing a substrate core including a glass-cloth or prepreg core.

11 . A method of making an inductor comprising:
providing a dielectric layer with a first surface and a second surface; drilling the dielectric layer from the first surface to the second surface to form an aperture in the first and second surfaces, the aperture including an aperture wall from the first surface to the second surface; depositing a conductive layer on the first surface, second surface, and the aperture wall; and cutting a portion of the conductive layer through the entire thickness to form one or more coils on the aperture wall, wherein the coil encircles the aperture wall in at least one revolution from the first surface to the second surface.

12 . The method of claim 11 , wherein cutting a portion of the conductive layer on the aperture wall includes removing the conductive layer with a coil cutting bit.

13 . The method of claim 12 , wherein cutting the portion of the conductive layer on the aperture wall with the coil cutting bit includes:
rotating and translating the coil cutting bit in a sequence along a path from the first surface to the second surface thereby removing the conductive layer on the aperture wall; and rotating and translating the coil cutting bit in a reverse sequence along the path to withdrawal the coil cutting bit from the aperture.

14 . The method of claim 13 , wherein the sequence includes a helical path.

15 . The method of claim 11 , further comprising locating a magnetic core within the aperture.

16 . The method of claim 15 , wherein locating the magnetic core within the aperture includes depositing, within the aperture, magnetic particles suspended in a carrier.

17 . The method of claim 16 , wherein the magnetic particles include at least one of iron, manganese-zinc ferrite, molybdenum, nickel-zinc, sendust, and silicon steel.

18 . The method of claim 16 , wherein the magnetic core is disposed in physical contact with the aperture wall between segments of the coil.

19 . The method of claim 16 , wherein the magnetic core is disposed in physical contact with separate segments of the coil.

20 . The method of claim 11 , wherein providing the dielectric layer includes providing a substrate core.

Assignees

• Intel Corp

Inventors

• Lambert William J
• Roy Mihir K
• Manusharow Mathew J
• Deng Yikang

Classifications

• H01F41/0206

  Manufacturing of magnetic cores by mechanical means (magnetic cores per se H01F27/24) · CPC title

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F17/0033

  with the coil helically wound around a magnetic core · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title