Electronic component having multilayer structure and method of manufacturing the same
US-2018254149-A1 · Sep 6, 2018 · US
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Patent family 55655931
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55655931 |
| Family type | — |
| Earliest priority | Oct 8, 2014 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US2018254149A1 — Electronic component having multilayer structure and method of manufacturing the same |
Representative publication
Best representative member for this family based on priority and filing country.
US2018254149A1 — Electronic component having multilayer structure and method of manufacturing the same (published Sep 6, 2018)
Member publications
Related publications in this family.
Electronic component having multilayer structure and method of manufacturing the same
US-9865399-B2 · Jan 9, 2018 · US
Electronic component having multilayer structure and method of manufacturing the same
US-2017358396-A1 · Dec 14, 2017 · US
Electronic component and method of manufacturing the same
US-2016104577-A1 · Apr 14, 2016 · US