Electronic component having multilayer structure and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9865399-B2
Application number	US-201514876774-A
Country	US
Kind code	B2
Filing date	Oct 6, 2015
Priority date	Oct 8, 2014
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.

First claim

What is claimed is:

1. An electronic component comprising:
a laminate having a plurality of stacked different types of multi-layered ceramic capacitors; and
an external electrode made of a conductive resin for connecting each ceramic body,
wherein two multi-layered ceramic capacitors stacked from at a lowermost surface of the laminate sequentially are selected among a T-HMC structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor, and
the remaining except two multi-layered ceramic capacitors stacked from the lowermost surface sequentially are normal structure multi-layered ceramic capacitors.

2. The electronic component according to claim 1 , further comprises:
an adhesive for adhering between the multi-layered ceramic capacitors.

3. The electronic component according to claim 1 , further comprises:
a metal layer plated on a surface of the external electrode.

4. An electronic component comprising:
a laminate including a plurality of ceramic bodies stacking one on another and one or more adhesive layers interposed therebetween, each ceramic body including a plurality of first internal electrodes exposed to one end of the laminate and a plurality of second internal electrodes exposed to another end of the laminate, and the first and second internal electrodes of ceramic bodies including a first boundary internal electrode and a second boundary internal electrode, wherein all the other first and second internal electrodes of the ceramic bodies are interposed between the first and second boundary internal electrodes;
a first external electrode formed of a conductive resin on the one end of the laminate and electrically connected to the plurality of first internal electrodes of the plurality of ceramic bodies; and
a second external electrode formed of the conductive resin on the other end of the laminate and electrically connected to the plurality of second internal electrodes of the plurality of ceramic bodies,
wherein in a vertical direction in which the ceramic bodies are stacked, each internal electrode of the ceramic body to which the first boundary internal electrode belongs, overlaps extension portions of only one of the first and second external electrodes, and in the vertical direction, each internal electrode of the ceramic body or the ceramic bodies to which the first boundary internal electrode does not belong, overlaps the extension portions of both of the first and second external electrodes, and
the shortest distance, from the adhesive layer interposed between the ceramic body to which the first boundary internal electrode belongs and the ceramic body immediately adjacent to the ceramic body to which the first boundary internal electrode belongs, to any internal electrodes of the ceramic body immediately adjacent to the ceramic body to which the first boundary internal electrode belongs, is greater than a distance between the first boundary internal electrode and a bottom exterior surface of the laminate connected between the ends of the laminate.

5. The electronic component of claim 4 , wherein a dielectric material interposed between the internal electrodes of the same ceramic body is different from a material forming the one or more adhesive layers.

6. The electronic component of claim 5 , wherein the dielectric material is piezoelectric or electrostrictive.

7. The electronic component of claim 4 , further comprising a metal layer plated on each external electrode.

8. An electronic component comprising:
a laminate including a plurality of ceramic bodies stacked one on another and one or more adhesive layers interposed therebetween, each ceramic body including a plurality of first internal electrodes exposed to one end of the laminate and a plurality of second internal electrodes exposed to the other end of the laminate, and the first and second internal electrodes of ceramic bodies including a first boundary internal electrode and a second boundary internal electrode, wherein all remaining first and second internal electrodes of the ceramic bodies are interposed between the first and second boundary internal electrodes;
a first external electrode formed of a conductive resin on the one end of the laminate and electrically connected to the plurality of first internal electrodes of the plurality of ceramic bodies; and
a second external electrode formed of the conductive resin on the other end of the laminate and electrically connected to the plurality of second internal electrodes of the plurality of ceramic bodies,
wherein a distance between the first boundary internal electrode and a bottom exterior surface of the laminate connected between the ends of the laminate is larger than a distance between the second boundary internal electrode and a top exterior surface of the laminate connected between the ends of the laminate, and is larger than any distances of the one or more adhesive layers to the internal electrodes which are immediately adjacent to the respective one or more adhesive layers.

9. The electronic component of claim 8 , wherein the distance between the second boundary internal electrode and the top surface of the laminate connected between the ends of the laminate, and each distance between the one or more adhesive layers and the internal electrodes which are immediately adjacent to the respective one or more adhesive layers, are substantially equal to each other.

10. The electronic component of claim 8 , wherein in a vertical direction along which the ceramic bodies stack, each internal electrode overlaps with extension portions of both of the first and second external electrodes.

11. An electronic component comprising:
a laminate including a plurality of ceramic bodies stacked one on another and one or more adhesive layers interposed therebetween, each ceramic body including a plurality of first internal electrodes exposed to one end of the laminate and a plurality of second internal electrodes exposed to the other end of the laminate, and the first and second internal electrodes of ceramic bodies including a first boundary internal electrode and a second boundary internal electrode, wherein all the other first and second internal electrodes of the ceramic bodies are interposed between the first and second boundary internal electrodes;
a first external electrode formed of a conductive resin on the one end of the laminate and electrically connected to the plurality of first internal electrodes of the plurality of ceramic bodies; and
a second external electrode formed of the conductive resin on the other end of the laminate and electrically connected to the plurality of second internal electrodes of the plurality of ceramic bodies,
wherein the ceramic body, which the first boundary internal electrode belongs to, includes a plurality of floating internal electrodes not electrically connected to any of the first and second external electrodes, and in the ceramic body, which the first boundary internal electrode belongs to, one of the first internal electrodes and one of the second internal electrodes are formed on a same plane, and
a distance between the first boundary internal electrode and a bottom exterior surface of the laminate connected between the ends of the laminate is larger than a distance between the second boundary internal electrode and a top exterior surface of the laminate connected between the ends of the laminate, and is larger than any distances of the one or more adhesive layers to the internal electrodes which are immediately adjacent to the respective one or more adhesive layers.

12. The electronic component of claim 4 ,

Assignees

• Samsung Electro Mech

Inventors

• Cho Sung Hun
• Lee Chang Ho
• Chong Won Sik

Classifications

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/385 Primary

  Single unit multiple capacitors, e.g. dual capacitor in one coil · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title