Capacitor and method for manufacturing same
US-2024347278-A1 · Oct 17, 2024 · US
Electronic component having multilayer structure and method of manufacturing the same
US2018254149A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018254149-A1 |
| Application number | US-201815970281-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 3, 2018 |
| Priority date | Oct 8, 2014 |
| Publication date | Sep 6, 2018 |
| Grant date | — |
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- Title
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- Abstract
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electronic component comprising: a laminate formed by stacking a plurality of different types of multi-layered ceramic capacitors; and an external electrode made of a conductive resin for connecting each ceramic body, wherein the multi-layered ceramic capacitors is selected from a group consisting of a normal structure multi-layered ceramic capacitor, an open structure multi-layered ceramic capacitor, a thick & horizontally mounted capacitor (T-HMC) structure multi-layered ceramic capacitors, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor, and wherein the multi-layered ceramic capacitor arranged at a most bottom of the laminate is a float structure multi-layered ceramic capacitor. 2 . The electronic component according to claim 1 , wherein the remaining multi-layered ceramic capacitor except a lowermost multi-layered ceramic capacitor is the normal structure multi-layered ceramic capacitor. 3 . The electronic component according to claim 2 , wherein the normal structure multi-layered ceramic capacitor is formed of at least two. 4 . The electronic component according to claim 1 , further comprises: an adhesive for adhering between the multi-layered ceramic capacitors. 5 . The electronic component according to claim 1 , further comprises: a metal layer plated on a surface of the external electrode. 6 . An electronic component comprising: a laminate formed by stacking a plurality of different types of multi-layered ceramic capacitors; and an external electrode made of a conductive resin for connecting each ceramic body, wherein the multi-layered ceramic capacitors is selected from a group consisting of a normal structure multi-layered ceramic capacitor, an open structure multi-layered ceramic capacitor, a thick & horizontally mounted capacitor (T-HMC) structure multi-layered ceramic capacitor, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor, and wherein the multi-layered ceramic capacitor arranged at a most bottom of the laminate is a T-HMC-open structure multi-layered ceramic capacitor. 7 . The electronic component according to claim 6 , wherein the remaining multi-layered ceramic capacitor except a lowermost multi-layered ceramic capacitor is the normal structure multi-layered ceramic capacitor. 8 . The electronic component according to claim 7 , wherein the normal structure multi-layered ceramic capacitor is formed of at least two. 9 . The electronic component according to claim 6 , further comprises: an adhesive for adhering between the multi-layered ceramic capacitors. 10 . The electronic component according to claim 6 , further comprises: a metal layer plated on a surface of the external electrode. 11 . An electronic component comprising: a laminate formed by stacking a plurality of different types of multi-layered ceramic capacitors; and an external electrode made of a conductive resin for connecting each ceramic body, wherein the multi-layered ceramic capacitors is selected from a group consisting of a normal structure multi-layered ceramic capacitor, an open structure multi-layered ceramic capacitor, a thick & horizontally mounted capacitor (T-HMC) structure multi-layered ceramic capacitor, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor, and wherein the multi-layered ceramic capacitor arranged at a most bottom of the laminate is a T-HMC-Float structure multi-layered ceramic capacitor. 12 . The electronic component according to claim 11 , wherein the remaining multi-layered ceramic capacitor except a lowermost multi-layered ceramic capacitor is the normal structure multi-layered ceramic capacitor. 13 . The electronic component according to claim 12 , wherein the normal structure multi-layered ceramic capacitor is formed of at least two. 14 . The electronic component according to claim 11 , further comprises: an adhesive for adhering between the multi-layered ceramic capacitors. 15 . The electronic component according to claim 11 , further comprises: a metal layer plated on a surface of the external electrode.
Assignees
Inventors
Classifications
- H01G4/30Primary
Stacked capacitors (H01G4/33 takes precedence) · CPC title
Form of non-self-supporting electrodes · CPC title
based on alkaline earth titanates · CPC title
- H01G4/385Primary
Single unit multiple capacitors, e.g. dual capacitor in one coil · CPC title
characterised by the material of the terminals · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2018254149A1 cover?
- An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Sep 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).