Electronic component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016104577-A1
Application number	US-201514876774-A
Country	US
Kind code	A1
Filing date	Oct 6, 2015
Priority date	Oct 8, 2014
Publication date	Apr 14, 2016
Grant date	—

Abstract

An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.

First claim

What is claimed is:

1 . An electronic component comprising:
a laminate formed by stacking a plurality of ceramic bodies; and an external electrode made of a conductive resin for connecting each ceramic body.

2 . The electronic component according to claim 1 , further comprises:
an adhesive for adhering between the ceramic bodies.

3 . The electronic component according to claim 1 , wherein the ceramic bodies are multi-layered ceramic capacitors (MLCC).

4 . The electronic component according to claim 3 , wherein each of the multi-layered ceramic capacitors has an inner electrode structure different from each other.

5 . The electronic component according to claim 3 , wherein each of the multi-layered ceramic capacitors has an electrostatic capacity different from each other.

6 . The electronic component according to claim 1 , further comprising a metal layer plated on the external electrode.

7 . An electronic component comprising:
a laminate formed by stacking a plurality of different types of multi-layered ceramic capacitors; and an external electrode made of a conductive resin for connecting each ceramic body, wherein the multi-layered ceramic capacitors is selected from a group consisting of a normal structure multi-layered ceramic capacitor, an open structure multi-layered ceramic capacitor, a thick & horizontally mounted capacitor (T-HMC) structure multi-layered ceramic capacitors, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor.

8 . The electronic component according to claim 7 , wherein the multi-layered ceramic capacitor arranged at a most bottom of the laminate is one of an open structure multi-layered ceramic capacitor, a T-HMC structure multi-layered ceramic capacitors, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor.

9 . The electronic component according to claim 8 , wherein the remaining multi-layered ceramic capacitor except a lowermost multi-layered ceramic capacitor is the normal structure multi-layered ceramic capacitor.

10 . The electronic component according to claim 9 , wherein the normal structure multi-layered ceramic capacitor is formed of at least two.

11 . The electronic component according to claim 7 , wherein two multi-layered ceramic capacitors stacked from at a lowermost surface of the laminate sequentially are selected among the open structure multi-layered ceramic capacitor, the T-HMC structure multi-layered ceramic capacitors, the float structure multi-layered ceramic capacitor, the T-HMC-open structure multi-layered ceramic capacitor, and the T-HMC-Float structure multi-layered ceramic capacitor, and
the remaining except two multi-layered ceramic capacitors stacked from the lowermost surface sequentially are the normal structure multi-layered ceramic capacitor.

12 . The electronic component according to claim 7 , further comprises:
an adhesive for adhering between the multi-layered ceramic capacitors.

13 . The electronic component according to claim 7 , further comprises:
a metal layer plated on a surface of the external electrode.

14 . A method of manufacturing an electronic component comprising:
preparing a plurality of different multi-layered ceramic capacitors; stacking the plurality of multi-layered ceramic capacitors; and forming external terminals made of a conductive resin on opposite ends of a laminate obtained by stacking the plurality of multi-layered ceramic capacitors.

15 . The method of manufacturing the electronic component according to claim 14 , wherein, when the plurality of multi-layered ceramic capacitors are stacked, any one of the multi-layered ceramic capacitors selected from an open structure, a T-HMC structure, a float structure, a T-HMC-open structure, a T-HMC-float structure is arranged at a lowermost surface.

16 . The method of manufacturing the electronic component according to claim 15 , wherein the normal structure multi-layered ceramic capacitor is stacked on a top of the lowermost multi-layered ceramic capacitor.

17 . The method of manufacturing the electronic component according to claim 14 , wherein, when the plurality of multi-layered ceramic capacitors are stacked, after any one of the multi-layered ceramic capacitors selected from an open structure, a T-HMC structure, a float structure, a T-HMC-open structure, a T-HMC-float structure is arranged at a lowermost surface, a multi-layered ceramic capacitor having a structure different from the lowermost multi-layered ceramic capacitor among the T-HMC structure, the float structure, the T-HMC-open structure and the T-HMC-float structure is stacked and a normal structure multi-layered ceramic capacitor is stacked on an uppermost surface.

18 . The method of manufacturing the electronic component according to claim 14 , wherein, when the plurality of multi-layered ceramic capacitors are stacked, after an adhesive resin is coated between the multi-layered ceramic capacitors, it is cured.

19 . The method of manufacturing the electronic component according to claim 14 , wherein forming the external terminals is performed by sintering after coating a conductive paste on opposite ends of the laminate.

20 . An electronic component comprising:
a laminate including a plurality of ceramic bodies stacking one on another and one or more adhesive layers interposed therebetween, each ceramic body including a plurality of first internal electrodes exposed to one end of the laminate and a plurality of second internal electrodes exposed to another end of the laminate, and the first and second internal electrodes of ceramic bodies including a first boundary internal electrode and a second boundary internal electrode, wherein all the other first and second internal electrodes of the ceramic bodies are interposed between the first and second boundary internal electrodes; a first external electrode formed of a conductive resin on the one end of the laminate and electrically connected to the plurality of first internal electrodes of the plurality of ceramic bodies; and a second external electrode formed of the conductive resin on the other end of the laminate and electrically connected to the plurality of second internal electrodes of the plurality of ceramic bodies.

21 . The electronic component of claim 20 , wherein a dielectric material interposed between the internal electrodes of the same ceramic body is different from a material forming the one or more adhesive layers.

22 . The electronic component of claim 21 , wherein the dielectric material is piezoelectric or electrostrictive.

23 . The electronic component of claim 20 , further comprising a metal layer plated on each external electrode.

24 . The electronic component of claim 20 , wherein a width of each internal electrode of the ceramic body which the first boundary internal electrode belongs to, determined in a direction from the first external electrode to the second external electrode, is less than that of any other internal electrodes.

25 . The electronic component of claim 20 , wherein:
in a vertical direction along which the ceramic bodies stack, each internal electrode of the ceramic body which the first boundary internal electrode belongs to, overlaps with extension

Assignees

• Samsung Electro Mech

Inventors

• Cho Sung Hun
• Lee Chang Ho
• Chong Won Sik

Classifications

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/385 Primary

  Single unit multiple capacitors, e.g. dual capacitor in one coil · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title